Application Questionnaire
Kindly fill out details to the questions relevant to your application. Your answers will help us recommend a suitable solution for your application. If you need any further assistance, you can email us at technical@kohesibond.com or call us at +91 22 2566 9144.

What device are you manufacturing?
Stage of Application : Early DesignPrototypeProduction
What kind of product do you prefer? : One ComponentTwo ComponentOther
TYPE OF APPLICATION
BondingCoatingSealingPotting/ Encapsulation/ Casting
Bonding/ Sealing Application:
What substrates do you wish to bond? (Please specify the name of the plastic/ rubber/ metal or any other material that you are bonding)
What are the dimensions of the substrates that you are bonding?
What is the bonding area? (Area over which the adhesive will be applied)
Coating Application:
What substrates do you wish to coat? (Please specify the name of the plastic/ rubber/ metal or any other material that you are coating)
What is the principal reason for coating the substrates?
What are the dimensions of the substrates that you are coating?
How thick of a coating layer will you apply?
Potting Application:
What housing substrate do you wish to pot in? (Please specify the name of the plastic/ rubber/ metal or any other material that you are potting in)
What other substrates do you need adhesion to?
What are the dimensions of the housing for potting? (L x W x D or Dia x Depth)
What percent (%) of the housing substrate is occupied by other components?
TEMPERATURE CONDITIONS
What are the minimum and maximum temperatures that the adhesive will be exposed to during service?
How many thermal cycles will the adhesive be exposed to?
How long will the adhesive be exposed to the extreme temperatures? (dwell time)
What are the ramp speeds?
What are the normal operative temperatures?
MECHANICAL FORCES
What mechanical forces would be acting on the adhesives? (Indicate quantity if possible. If not, indicate magnitude whether they would be high or low)
Pressure or Load (Tensile/ Compression/ Shear)
Shock
Vibrations
CHEMICAL EXPOSURE
Will the adhesive be exposed to any chemicals? (Please specify the chemicals)
How will the exposure to the chemicals take place? (Continuous immersion/ vapor/ splash)
What is the percent (%) concentration of the chemicals involved?
How long at a time will the adhesive be exposed to these chemicals?
How many times will the adhesive be exposed to these chemicals?
At what temperature will the adhesive be exposed to these chemicals?
THERMAL AND ELECTRICAL PROPERTIES
Do you require the adhesive to be (Please quantify wherever possible) :
Thermally ConductiveElectrically InsulatingElectrically Conductive
OPTICAL PROPERTIES
Do you require optical clarity? YesNo
If yes, what wave length do you require optical clarity in?
Do you have any specific refractive index requirement?
If not, do you have any other color preference?
INDUSTRAIL CERTIFICATION
Low out gassing: GenericNASA Standards (ASTM E - 595)
Food Grade: FDA 175.105FDA 175.300
USP Class VI:
Type of Sterilization
Repeated Sterilization YesNo
If yes, how many?
Flame Retardancy: UL 94V - OFAR 25.853 A
ADDITIONAL QUESTIONS
What kind of viscosity are you looking for? (Please provide specific values in cps or indicate whether you prefer a non-drip paste/ high/ medium/ low viscosity)
Can you add heat for curing? If yes, what is the maximum temperature up to which you can add heat for curing?
What is the mode of application for the adhesive?
Would you like the adhesive to cure rigid or flexible? (Please specify the Shore (A or D) hardness value)
What kind of working life (pot life) do you prefer?
What kind of cure time do you prefer?
PREVIOUS TESTING
What other products have you tried using for this application?
Please specify the problems associated with the products tried:
What was the percent (%) failure?
How long have you been using this product?
SUPPLEMENTARY INFORMATION
Please provide any additional details or pictures that will assist us in choosing a suitable solution for your application:
Attach file: