PRODUCT RELEASE

PRODUCT RELEASE 09 May 2017

Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.