Aerospace Grade Epoxies: Meeting NASA’s Low Outgassing Standards with Kohesi Bond

Aerospace grade epoxy adhesive by Kohesi Bond meeting NASA low outgassing standards for space and aviation applications

In space, every molecule matters. One microscopic layer of condensed volatiles on a star tracker lens or a thermal radiator can distort measurements that entire mission timelines depend on. 

This phenomenon, outgassing, is predictable, measurable, and, if ignored, mission-threatening. 

When polymers encounter vacuum or sharp thermal gradients, their trapped monomers, oligomers, plasticisers, and absorbed moisture transition into vapour and migrate through the spacecraft. And in a vacuum as unforgiving as 10⁻⁶ to 10⁻⁸ torr, even a few micrograms of residue can mean optical attenuation, electronic drift, or thermal imbalance.

NASA originally developed the test method, which is now standardised as ASTM E595 under ASTM International for evaluating outgassing of spacecraft materials. 

Whether we’re talking about large GEO satellites, deep-space telescopes, CubeSats, or optical benches, materials must demonstrate extremely low volatile release to be considered safe for flight.

This danger is exactly where highly engineered aerospace-grade epoxy systems come into play. 

They offer the structural strength and thermal stability engineers demand without adding molecular contamination. 

At Kohesi Bond, we engineer aerospace-grade epoxy systems precisely tested to meet NASA’s stringent low-outgassing standards, ensuring spacecraft operate cleanly, predictably, and reliably over multi-year missions.

A] What is Outgassing, and Why Does It Matter in Aerospace Applications?

1. Definition and Mechanism

Let’s begin with a clear, technical definition.

Outgassing is the diffusion, desorption, and evaporation of volatile species from a polymer matrix when exposed to vacuum or thermal energy.

Under vacuum, the vapour pressure differential accelerates the release of:

  • Unreacted monomers
  • Solvents or catalysts
  • Moisture
  • Decomposition products

Outgassing behaviour approximately follows an Arrhenius-type temperature dependence:

D = D₀ exp(–Eₐ/RT)

Understanding the Equation:

  • D: The diffusion coefficient (how fast molecules move out of the material).
  • D₀: A pre-exponential factor constant.
  • E: The Activation Energy required for a molecule to break free.
  • R: The Universal Gas Constant.
  • T: Absolute Temperature (in Kelvin).

Why it matters: This equation shows that as temperature ($T$) increases, the rate of outgassing grows exponentially. 

Even a small rise in spacecraft temperature can significantly lower the polymer’s resistance to diffusion, causing a surge in mass loss and potential contamination of nearby sensors.

2. Impact on Aerospace Components

Now picture what happens next.

Volatiles migrate until they reach colder regions such as optical sensors, star trackers, IR detectors, and thermal radiators. There, they condense as nanometre-thin molecular films, leading to:

  • Optical contamination: Reduced transmissivity in UV/visible/IR bands
  • Electronic interference: Changes in surface resistivity or dielectric behaviour
  • Thermal imbalance: Altered emissivity/absorptivity of radiators
  • Sensor drift: Contamination on photodiodes and spectroscopic instruments

A contamination layer only 50–100 nm thick can significantly alter radiation absorption curves. This is non-negotiable territory for aerospace engineers.

3. Industry Need for Low-Outgassing Materials

Aerospace, high-vacuum semiconductor fabs, defence payloads, and cryogenic systems all share a fundamental requirement: molecular cleanliness.
Low-outgassing polymers ensure:

  • Dimensional stability under load
  • Predictable behaviour under radiation and thermal cycling
  • Long-term reliability of instrumentation

This is why the search for space-qualified epoxy adhesive systems is so central to mission assurance.

4. Kohesi Bond’s Perspective

From Kohesi Bond’s standpoint, controlling outgassing is an engineering philosophy, not a checkbox. We rely on:

  • Purified epoxy resins
  • Ultra-stable curing agents
  • Vacuum-compatible fillers
  • Controlled manufacturing environments

Together, they yield high-performance aerospace epoxy systems engineered for zero-compromise reliability in vacuum conditions.

B] Understanding NASA’s Low-Outgassing Requirements (ASTM E595)

1. Overview of ASTM E595

NASA developed ASTM E595 because early spacecraft missions discovered that uncontrolled polymer outgassing could degrade optics and electronics, even when the adhesive seemed perfectly stable on Earth. This standard quantifies how much volatile material a polymer releases under conditions that mimic space:

  • Temperature: 125°C
  • Vacuum: < 5 × 10⁻⁵ torr
  • Duration: 24 hours

2. Key Parameters

ASTM E595 defines two measurable outcomes:

  • TML — Total Mass Loss
    • Required: ≤ 1.00%
    • Indicates total volatilisation from the polymer.

  • CVCM — Collected Volatile Condensable Material
    • Required: ≤ 0.10%
    • Represents volatiles that condense on a collector plate, mimicking spacecraft optics.
  • WVR — Water Vapour Regain
    • No fixed acceptance limit (used for secondary qualification)
    • Quantifies the amount of moisture the material reabsorbs after vacuum exposure. WVR helps differentiate between true organic volatile loss and simple moisture evaporation, enabling accurate evaluation of borderline results.

Together, these metrics define the molecular cleanliness of an adhesive or polymer under simulated space conditions.

CVCM, in particular, is the parameter optical engineers obsess over, and for good reason.

3. Testing Methodology

Here is the essential sequence:

  • Prepare and precondition the sample.
  • Record its initial mass.
  • Expose to 125°C under high vacuum for 24 hours.
  • Collect condensed volatiles on a mirror-finish plate at 25°C.
  • Reweigh the sample and the collector to derive:
    • TML = ((m₀ – m₁)/m₀) × 100%

Understanding the Variables:

m₀: The initial mass of the epoxy sample before testing.

m₁: The final mass of the sample after being subjected to 125°C in a vacuum for 24 hours.

Why it matters: If the TML is higher than 1.00%, it indicates the material is unstable. However, if much of that loss is just water (measured by WVR), the material might still be flight-worthy.

This multi-step approach isolates moisture loss from true organic volatilisation, giving engineers a detailed picture of a material’s contamination risk.

While TML tells us what was left of the material, CVCM tells us what actually “stuck” to the cold surfaces of the spacecraft. It is calculated as:

CVCM = ((m_cp1 − m_cp0) / m_0) × 100%

Where:

m_cp0 = Initial mass of the collector plate (“mirror”)

m_cp1 = Final mass of the collector plate after the test

m_0   = Original mass of the epoxy sample

Why it matters: This is the most critical number for optical engineers. A CVCM of more than 0.10% means too many “sticky” molecules are landing on lenses or mirrors, which could fog a telescope or star tracker, potentially ending a mission.

Once testing is complete, the material is evaluated using NASA’s acceptance criteria:

  • CVCM < 0.10% and TML < 1.00% — PASS
    The material meets NASA’s low-outgassing requirements without qualification.
  • CVCM < 0.10% and TML > 1.00% — CONDITIONAL PASS if (TML – WVR) < 1.00%
    If mass loss is primarily due to moisture and not organic volatiles, the material can still be accepted.
  • CVCM > 0.10% or (TML – WVR) > 1.00% — FAIL
    The material poses a contamination risk and is unsuitable for flight hardware.

This pass–fail matrix ensures that only materials with demonstrably low contaminant potential are allowed near sensitive spaceflight assemblies.

4. Compliance Significance

Whether you’re bonding optical benches, potting electronics, or assembling internal spacecraft structures, materials that fail E595 don’t fly. It’s that simple.

5. Kohesi Bond’s Conformance

Every NASA low-outgassing epoxy developed by Kohesi Bond undergoes:

  • In-house chemistry screening
  • Third-party ASTM E595 verification
  • Batch-to-batch consistency checks

This ensures unmatched reliability for space and vacuum platforms.

Ready to meet NASA’s low outgassing standards?

Kohesi Bond’s aerospace epoxies deliver proven performance.

C] Methods for Reducing Outgassing in Epoxy Systems

1. Material Selection

Reducing outgassing starts long before formulation. It begins with selecting:

  • Low-volatility bisphenol or cycloaliphatic epoxy resins
  • Thermally robust aromatic hardeners
  • Pre-dried fillers such as BN, silica, or alumina
  • Additives free from plasticisers or reactive low-molecular-weight species

Space-grade epoxy systems depend on raw materials engineered for stability.

2. Process Control

This is where many aerospace adhesives fail.
Kohesi Bond’s process controls include:

  • Vacuum degassing to eliminate microbubbles and dissolved gases
  • Vacuum-assisted mixing to avoid air entrapment during resin-hardener integration
  • Pre-curing control to prevent aggressive exothermic spikes
  • Tight moisture control before application

When diffusion pathways are minimised, outgassing drops dramatically.

3. Surface Preparation and Cleanliness

Clean surfaces mean fewer trapped volatiles:

  • Solvent or plasma cleaning removes organic residues.
  • Passivation creates chemically stable surfaces.
  • Controlled humidity (<40% RH) prevents moisture absorption

These are small steps with disproportionate impact.

4. Formulation Optimisation

In high-performance aerospace epoxies, the Diffusion Coefficient (D) is inversely related to the Crosslink Density (ν).

This relationship can be conceptually expressed as:

D ∝ 1 / ν

Why it matters:

By increasing the “tightness” of the molecular network (crosslink density), Kohesi Bond limits the ability of unreacted molecules to move through the polymer matrix. 

A higher crosslink density behaves like a finer mesh, physically trapping volatiles and preventing them from escaping into the vacuum of space.

Here’s where chemistry becomes mission-critical:

  • Higher crosslink density = lower diffusion coefficient
  • Advanced fillers reduce shrinkage and microvoid formation
  • High-Tg (>150–200°C) systems resist decomposition under thermal load.
  • Nanofillers improve dimensional stability without raising TML.

A well-optimised formulation is engineered with intentional precision, not guesswork.

5. Kohesi Bond’s Engineering Approach

Kohesi Bond focuses on balancing:

  • Thermal stability
  • Adhesion performance
  • Dimensional stability
  • Ultra-low volatile content

The result is high-temperature aerospace epoxy with reliable E595 compliance and exceptional vacuum performance.

D] Kohesi Bond’s Aerospace-Grade Epoxies (NASA E595 Compliant)

1. Tested and Certified Epoxy Grades

Kohesi Bond offers space-qualified epoxy adhesive systems that consistently meet NASA’s thresholds, including:

  • Low-CTE epoxies for optical and structural alignment
  • High-Tg formulations (180–200°C+) for thermal subsystem components
  • Low-shrinkage encapsulants for electronics and sensor housings
  • Thermally robust, radiation-resistant grades for harsh orbits

Every formulation is engineered from the ground up with outgassing control as a core requirement.

2. Applications

These epoxy systems support:

  • Satellite payload assembly
  • Optical bench bonding
  • Thermal subsystem bonding
  • Sensor integration
  • Electronic encapsulation in vacuum systems

All applications fall within strict contamination control guidelines.

3. Key Performance Properties

Kohesi Bond epoxies deliver:

  • Low CTE values for dimensional precision
  • High adhesion performance across metals, composites, and ceramics
  • NASA E595 compliance: TML < 1%, CVCM < 0.1%
  • Resistance to radiation, thermal cycling, and vacuum exposure

These characteristics are essential for long-duration orbital and deep-space missions.

4. Industry Validation

Our formulations undergo:

  • ASTM E595 verification
  • TGA
  • DMA
  • Comprehensive contamination testing

This is why aerospace and defence stakeholders increasingly turn to Kohesi Bond for epoxy for space applications.

5. Collaborative Support

Kohesi Bond’s engineering team collaborates directly with mission integrators, ensuring that each epoxy bonding adhesive formulation aligns with environmental profiles such as LEO, MEO, GEO, lunar, or deep space.

E] Conclusion

In the vacuum of space, even trace contaminants can jeopardise billion-dollar missions. 

NASA’s ASTM E595 standard remains the definitive global benchmark for molecular cleanliness, ensuring adhesives and polymers behave predictably in orbit. Kohesi Bond’s epoxy portfolio is engineered, tested, and validated to meet these requirements with exceptional consistency.

From high-precision two-part epoxy adhesive formulations to mission-ready one-part epoxy adhesives, Kohesi Bond develops materials engineered to maintain molecular stability and cleanliness under extreme vacuum conditions.

When reliability in extreme environments is non-negotiable, Kohesi Bond delivers space-ready epoxy systems built on precision, science, and a commitment to contamination-free performance.

Need epoxies that pass rigorous NASA specs?

Trust Kohesi Bond for mission-critical reliability.

FAQs

It is used for structural bonding, optical assembly alignment, electronic encapsulation, sensor mounting, and thermal subsystem integration in spacecraft, where low outgassing and high thermal stability are mandatory.

Prioritise NASA E595-tested materials with TML ≤ 1.00%, CVCM ≤ 0.10%, high Tg, low CTE, and verified vacuum compatibility through TGA/DMA. Ensure third-party documentation and consistency across production batches.

Because condensables can contaminate optics, sensors, radiators, and electronics. Even microgram-level deposits can degrade optical performance, thermal control, and electronic stability.

Optical bonding epoxies with extremely low CVCM (<0.05%), high dimensional stability, low shrinkage, and low CTE values offer the highest reliability. NASA E595-compliant grades are the industry standard.

Outgassing is evaluated using ASTM E595: samples are heated at 125°C under <5×10⁻⁵ torr vacuum for 24 hours. Weight changes determine TML, and collected condensables determine CVCM.

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