Thermally Conductive and Thermal Management Epoxy Adhesives
We manufacture thermally conductive epoxy and insulative systems engineered for reliable performance under sustained thermal stress, validated from cryogenic to high-temperature service.
- Wide Conductivity
- Cryogenic Reliability
- ASTM Verified
Featured Thermal Management Bonding Products
Discover our comprehensive range of custom-formulated thermally conductive epoxy adhesive systems designed for superior heat dissipation and performance in demanding thermal management applications. For advanced thermal bonding solutions, explore our product line below.
KB 1458 TC
Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer
TUF 1828 TC
Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. Firstly,
KB 1631 HTC-1
Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight.
Thermal Conductivity and Filler Engineering for Thermally Conductive Adhesives
We balance filler type and loading against CTE, Tg, and mechanical strength to hit the thermal profile your application needs. Large-mass castings generate their own cure exotherm, and an uncontrolled reaction can crack a part from the inside before it ever reaches service. This is why our thermally conductive potting compound range uses low-exotherm chemistry built for that mass.
We also engineer low outgassing epoxy systems for aerospace and medical manufacturers for vacuum and cleanroom environments, where volatile byproducts contaminate sensitive optics and electronics.
- Thermally conductive, electrically insulative fillers: alumina, boron nitride, and aluminium nitride (plus silver-filled options for dual thermal/electrical conductivity)
- Low-exotherm chemistry for large-mass potting
- Formulations engineered to help reduce CTE mismatch with common electronic substrates
- Validated cryogenic to high-temperature service range
Power electronics, LED, aerospace, and medical device manufacturers use our high thermal conductivity epoxy systems, tested to ASTM C177, ASTM E228, and related standards. We provide full traceability and custom formulation support on every batch.
Engineered for High-Reliability Thermal Applications
Leading OEMs in power electronics, LED, aerospace, and medical technology rely on our thermally conductive epoxy adhesive formulations for demanding heat-dissipation challenges. Each batch is fully traceable and validated against ASTM C177, ASTM E228, and related thermal standards.
When a standard grade can’t hit your target conductivity or CTE, our formulation team builds a heat conductive epoxy system that does. You get a formulation tested against your exact thermal performance requirements, as opposed to a generic datasheet.
Our catalogue spans 4 to 6 SKUs across the thermal property range, from insulative to highly conductive. Each is validated against the CTE, Tg, and service temperature demands of your application.
We back every product with direct, extensive technical support, which helps you select the right formulation before you commit to a production run.
- Need Proven Performance?
Test our ASTM-validated thermally conductive adhesives on your production line.
Your Partner in Technical Success.
Access comprehensive technical documentation and expert support to ensure optimal performance in your thermal management bonding applications.
Thermally Conductive Epoxy Adhesive Applications Across Your Process
Sustained thermal stress fails a bond differently depending on whether the problem is heat buildup, cryogenic embrittlement, or repeated thermal cycling. A generic heat resistant epoxy cannot solve all three. Explore how our tailored adhesive formulations perform under critical thermal and environmental conditions. Each system below can be engineered as a liquid, gel, or thermal conductive paste to match your specific assembly and dispensing requirements.
Our thermally conductive adhesives channel heat away from sensitive components using alumina, boron nitride, or aluminium nitride fillers, keeping the bond line electrically insulative where isolation matters most.
Where heat needs to be contained rather than dissipated, our insulative formulations limit thermal transfer across the bond line, protecting adjacent components from conducted heat.
Engineered with low-CTE, strain-relieving chemistry, these systems remain flexible and crack-resistant down to 4 K (−269°C), preventing micro-fracture in cryogenic sensor and fuel system applications.
Our heat resistant epoxy grades maintain mechanical and thermal integrity at sustained elevated service temperatures, holding performance where standard adhesives soften or degrade.
Formulated with elevated Tg to stay rigid and stable well above the maximum service temperature, preventing bond-line creep or softening under sustained thermal load.
Built for large-mass potting applications, this thermally conductive potting compound chemistry controls the curing reaction to prevent internal cracking from self-generated heat.
A reduced CTE profile keeps the cured adhesive’s expansion and contraction closely matched to common substrates, minimising interfacial stress across repeated temperature swings.
Designed to absorb repeated expansion-contraction cycles without delamination, these formulations resist fatigue failure in applications that move continuously between temperature extremes.
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Frequently Asked Questions
Thermally conductive epoxy moves heat away from a component while remaining electrically insulative, using fillers like alumina or boron nitride. A thermally conductive glue that is also electrically conductive utilises silver flake loading, making it ideal for grounding and die attach but unsuitable where electrical isolation is required.
Our range spans 0.15 to 5 W/m·K, covering insulative through highly conductive formulations. We formulate each grade to hold that conductivity across the full rated service temperature range.
Yes, our validated cryogenic service range extends down to 4 K (−269°C) and is engineered with low CTE and strain-relieving chemistry to resist micro-cracking and thermal shock. This makes them suitable for cryogenic sensor potting and aerospace fuel system components.
Our formulations are tested to ASTM C177, ASTM D5470, and ASTM E228 for thermal conductivity, thermal resistance, and thermal expansion. That data ships with your order, not just on request.
Yes, our formulation team builds custom-engineered systems tested to your exact conductivity, CTE, or service temperature target. Contact our technical team with your requirement to start the evaluation.