KB 1458 TC

Product Description
Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency of heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula:

R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive]

Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 – 40 × 10-6 m2·K/W. Since KB 1458 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 – 6 × 10-6 m2·K/W.

KB 1458 TC has a wide serviceable temperature range of -70°C to +150°C. It adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties and very low shrinkage upon cure. In addition, it offers excellent dimensional stability and a very low coefficient of thermal expansion (CTE). Part A and Part B are gray in color. Owing to its sensational thermal management properties KB 1458 TC is widely used in electronics, optical and specialty OEM industries.
Product Highlights
   Unrivaled heat transfer efficiency
   Low coefficient of thermal expansion (CTE)
   Superb mechanical strength properties
   Microns thin bond lines achievable
   Phenomenal electrical insulation properties
   Unlimited working life at room temperature
Typical Applications
   Bonding
   Sealing
Packaging
KB 1458 TC can be packaged in various sizes and units to conform to your needs.
Certification