Kohesi Bond’s UHV-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595) and can successfully operate at pressures up to 1 x 10-12 torr. One of the key concerns while selecting an adhesive for vacuum...
An unmanned aerial vehicle (UAV), most commonly known as a drone is an aircraft without the physical presence of a human pilot on the aircraft. It is a component of an unmanned aircraft system; which includes the UAV, a flight...
With the growing demand for wireless communications, the number of satellites being launched every year has more than doubled in the last decade. Satellites are launched into different orbits (low-Earth, medium-Earth and geostationary...
Liquid shims are epoxy-based pastes typically used to fill gaps encountered primarily in aircraft composite structures that allow better load transfer between mechanically fastened components. Key features to look for while selecting a...
Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. Using our extensive technical expertise, we offer these formulations with an array of performance and...
Electromagnetic and radio frequency interference damages your electronic devices by degrading their circuit’s performance or damaging them all together. Kohesi Bond’s engineers have developed first-rate epoxy and sodium...
Kohesi Bond has custom formulated adhesives, sealants, coatings, potting and impregnation compounds for successful use in the aerospace industry. These products are capable of passing strict industrial certifications, such as NASA...
Are you facing trouble with properly mixing a two component epoxy? Watch our latest technical tip to master the art of mixing epoxy adhesives! Video Transcript: Have you ever wondered how to thoroughly mix a two component epoxy system?...
Kohesi Bond has custom formulated adhesives, sealants, coatings, potting and impregnation compounds for successful use in the electronics industry. These products are widely used for conformal coating, die attach, glob top and wire...
PRODUCT RELEASE 21 September 2017 Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume....
PRODUCT RELEASE 12 September 2017 Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes...
PRODUCT RELEASE 31 August 2017 Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (Part A: Part B) mix ratio by...
ENHANCING ELECTRICAL INSULATION PROPERTIES OF EPOXIES 24 August 2017 Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in...
PRODUCT RELEASE 10 August 2017 Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only...
PRODUCT RELEASE – KB 1613 R80 03 August 2017 Epoxies make an excellent choice of material for space applications. However, selecting the right adhesive is extremely critical for the performance of various optical and electronic...
PRODUCT RELEASE – KB 1613 R80 16 May 2017 Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This product offers the highest level of...
PRODUCT RELEASE 09 May 2017 Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight....
PRODUCT RELEASE 02 May 2017 Kohesi Bond KB 1631 FR-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although KB 1631 FR-2 cures hard at...
PRODUCT RELEASE – KB 1613 R80 21 March 2017 Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any...
INFOGRAPHIC 06 April 2017 Discover our space approved epoxy system KB 1631 HTC-1 with the help of this infographic. It offers phenomenal thermal conductivity, cryogenic serviceability and it is capable of passing ASTM E-595 NASA...
PRODUCT RELEASE 04 April 2017 Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity...
ARTICLE: FILLERS FOR EPOXY RESINS 30 March 2017 In addition to resins and curing agents, fillers are the most common ingredient in an adhesive formulation. Depending on the type of filler employed, it can have varied effects on the...
PRODUCT RELEASE 28 March 2017 Kohesi Bond KB-SS-G is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards...
Technical Tip: Enhancing Electrical Insulation Properties for Epoxies 23 March 2017 Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely...
PRODUCT RELEASE 21 March 2017 Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In...
Customer’s Application The customer requires an epoxy potting compound for enclosing sensitive electronic components in an aluminum housing. These electronics are going to be used in space, under an extremely high vacuum environment....
Customer’s Application The customer wants to bond EUV optical substrates for lithography, where the epoxy will be exposed to immersion in acetone for cleaning. Additionally, they need the epoxy to set-up relatively quickly. Application...
Customer’s Application The customer that manufactures radio devices for military applications is looking for a sprayable coating to protect the device from electromagnetic interference. It is also important for the coating to provide...
Customer’s Application The customer is manufacturing an integral cryogenic tankage for Space Transportation Systems (STS) using an aluminum honeycomb sandwiched structure. Additionally, the application demands excellent heat transfer...
Customer’s Application The customer requires an epoxy for bonding electronic components on a kapton pad to a heat sink. Superior heat transfer capabilities are of importance. Application Discussion In order to recommend the right...
Case Study: Bonding Electronic Components Using Fast Curing Adhesives 10 August 2017 The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally...
Technical Tip: Adhesive Selection for Space Applications 10 August 2017 Epoxies make an excellent choice of material for space applications. However, selecting the right adhesive is extremely critical for the performance of various...
Customer’s Application The customer wants to bond EUV optical substrates for lithography, where the epoxy will be exposed to immersion in acetone during cleaning. Additionally, they need the epoxy to set up relatively quickly....
Customer’s Application The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals....
Customer’s Application The customer wants to bond to steel substrates to build a surgical instrument. The device will see high temperatures and steam sterilization. Application Discussion In order to recommend the right solution, our...
