Kohesi bond’s technical experts come across a wide range of applications. Each application is unique and so are their requirements. Read our factual case studies to uncover answers and product recommendations for various bonding, coating, sealing, potting and encapsulation applications.
 
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PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE 21 September 2017 Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume....

PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE 12 September 2017 Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes...

PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE 31 August 2017 Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (Part A: Part B) mix ratio by...

PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE 10 August 2017 Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only...

PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE – KB 1613 R80 16 May 2017 Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This product offers the highest level of...

PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE 09 May 2017 Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight....

PRODUCT RELEASE

March 16, 2018Newsletter

PRODUCT RELEASE 02 May 2017 Kohesi Bond KB 1631 FR-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although KB 1631 FR-2 cures hard at...

PRODUCT RELEASE

March 13, 2018Newsletter

PRODUCT RELEASE – KB 1613 R80 21 March 2017 Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any...

INFOGRAPHIC

March 13, 2018Newsletter

INFOGRAPHIC 06 April 2017 Discover our space approved epoxy system KB 1631 HTC-1 with the help of this infographic. It offers phenomenal thermal conductivity, cryogenic serviceability and it is capable of passing ASTM E-595 NASA...

PRODUCT RELEASE

March 13, 2018Newsletter

PRODUCT RELEASE 04 April 2017 Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity...

ARTICLE: FILLERS FOR EPOXY RESINS

March 13, 2018Newsletter

ARTICLE: FILLERS FOR EPOXY RESINS 30 March 2017 In addition to resins and curing agents, fillers are the most common ingredient in an adhesive formulation. Depending on the type of filler employed, it can have varied effects on the...

PRODUCT RELEASE

March 13, 2018Newsletter

PRODUCT RELEASE 28 March 2017 Kohesi Bond KB-SS-G is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards...

PRODUCT RELEASE

March 13, 2018Newsletter

PRODUCT RELEASE 21 March 2017 Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In...

IS THERE AN ADHESIVE FOR KAPTON BONDING?

March 5, 2018All, OTHER

Customer’s Application The customer requires an epoxy for bonding electronic components on a kapton pad to a heat sink. Superior heat transfer capabilities are of importance. Application Discussion In order to recommend the right...