Industrial Certification

Test Method:
This uncomplicated test begins by first conditioning the sample in a 50% relative humidity chamber for 24 hours. The sample is then placed in a vacuum test chamber at 125°C and a minimum vacuum of 5 × 10-5 torr. The volatiles outgassing the sample are collected on a collector plate cooled at 25°C during this time. The sample and the condensate are then weighed to determine the following:
CVCM: The amount of collected volatile condensable materials (CVCM) on the collector plate.
TML: The amount of total mass loss (TML) by the sample
WVR: The amount of water vapor regained (WVR) by the sample
The material is said to pass or fail the test based on the following conditions:
CVCM < 0.1% and TML < 1% - Pass
CVCM < 0.1% and TML > 1% – Pass if TML – WVR <1%
CVCM > 0.1% or TML – WVR > 1% – Fail
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KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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KB 1372-LO
Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
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TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
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KB 1031 AT-S
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
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KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
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KB 1613 HT
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact.
FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Adhesives, sealants and coatings are tested by individual laboratories to determine the amount of extractables in various solvents at elevated temperatures and are also tested for their toxicology. If the amount of extractables is less than 0.05 mg/ in2, the epoxy is said to have passed the FDA CFR 175.300 test standard and can be used for a more continued contact with food articles.
Kohesi Bond offers a variety of epoxy based, food safe products that are commonly used in the food industry. However, special care should be taken to ensure that all the FDA regulations regarding the use of adhesives in your food application are met.
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KB 1040 P
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
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KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
FAR 25.853 (a) is a standard for flame retardancy as defined by the Federal Aviation Regulation to test a material’s compliance for use in airline cabin, cargo and interiors. This test involves burning a cured sample at a specific angle for a defined amount of time. The material’s flame retardancy is then measured in terms of the burn time, length and rate. The test is performed in both horizontal and vertical positions. The vertical test specification is more challenging as compared to the horizontal test specifications. However, depending on your application either one of the test specifications might be sufficient. Kohesi Bond offers innovative products that are capable of meeting these requirements.
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KB 1600 FR-V
Kohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
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KB 1631 FR-2
KB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
- Lead (Pb)
- Mercury (Hg)
- Cadmium (Cd)
- Hexavalent Chromium (Cr VI)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
- Chlorine Content ≤ 900 ppm
- Bromine Content ≤ 900 ppm
- Total Halogen Content ≤ 1500 ppm
- Hexavalent Chromium (Cr VI)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
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KB 1631 HTC-1
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
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TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.