KB 1040 P
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
KB 10473 FLAO
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
KB 1613 HT
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
Kohesi Bond’s world class one and two component sealants offer ideal solutions to sophisticated and challenging industrial applications. These 100% reactive systems offer an assortments of properties, such as chemical resistance, optical clarity, resistance to thermal cycling, thermal and electrical conductivity and superior mechanical strength. They are widely used in various aerospace, oil and gas, chemical, electronic, optical, automotive and speciality OEM applications. Our products are available in various packaging options and offer easy of use as well as application. Our custom formulated sealants are typically used for sealing in MEMS, optical devices, semiconductors, electronics, industrial ovens and similar applications.