KB 1031 ATHT-LO
Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
KB 1031 SPLV-6
Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life.
KB 1631 AOLV-1
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
TUF 1613 HT-DA
TUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
TUF 1613 HT-GT
Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
Silver Filled Adhesives: Silver filled systems offer the highest electrical conductivity and the lowest volume resistivity of <10-3 ohm-cm. They are commonly used to replace solder.
Silver-coated Nickel Adhesives: Silver-coated nickel filled products offer a more cost effective alternative to silver filled systems, while maintaining very low volume resistivity of < 0.005 ohm-cm.
Nickel Filled Adhesives: Nickel filled systems offer a cost effective solution where high electrical conductivity is required. Typically, they offer a low volume resistivity of 5 – 10 ohm-cm.
Graphite Filled Adhesives: Graphite filled products offer an economical solution while maintaining good electrical conductivity. They provide a non-magnetic bond, high lubricity and a volume resistivity of 50 – 100 ohm-cm.
Kohesi Bond’s superior electrically conductive adhesives, sealants and coatings are extensively used for wire-bonding, die attach, EMI/RFI shielding, electrostatic discharge, grounding and antistatic applications.
KB 1031 ATFL-N
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability.
Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure.
TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.