Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications.KB 1631 ANHT being a filled system, offers first-rate dimensional stability and exceptionally low coefficient of thermal expansion. It offers an extensive serviceable temperature range of -50°C to +200°C. It is a phenomenal adhesive offering preeminent physical strength properties.

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures. TUF 1820 AOHT offers a sweeping serviceable temperature range of 4K (-269.15°C) to +200°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers a startling tensile lap shear strength of over 3,800 psi. In addition to superior electrical insulation, TUF 1820 AOHT also offers very good thermal conductivity.

Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. The highlight of this products is its superior optical clarity and its capability of passing NASA low outgassing test. In addition, this product offers very good flow properties, allowing it to be applied in extremely thin layers. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. KB 1040-2 can be serviced cryogenically.

Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in electronic and electrical applications. Choosing the right epoxy not only depends on its dielectric properties, but also on a number of properties such as temperature resistance, mechanical strength, chemical resistance and resistance to thermal and mechanical shocks and cycles.

Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room temperature. It cures exceptionally fast in 5 – 10 minutes at 150°C. TUF 1613 HT-DA dispenses ideally leaving no tail behind and can be easily used with automated dispensing equipment.

Epoxies make an excellent choice of material for space applications. However, selecting the right adhesive is extremely critical for the performance of various optical and electronic components in space. One of the key concerns while selecting an adhesive for space applications is its serviceability in extremely high vacuum environment. Systems operate under very high vacuum (~ 10^-8 torr) in space. Any outgassing from the adhesive could lead to failure of crucial components of the system.

Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This product offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI). Shielding effectiveness is extremely critical for electronic devices since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference. KB-SS-SIL has a wide serviceable temperature range of -30°C to +370°C. It is a water based system, making it relatively non-toxic.

Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

Kohesi Bond KB 1631 FR-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although KB 1631 FR-2 cures hard at room temperature, the optimum cure schedule would be an overnight room temperature set-up followed by an addition of heat at 90°C for 2 – 3 hours. KB 1631 FR-2 offers an extensive serviceable temperature range of -51°C to +90°C, as per UL 94V-0 specification. This product’s exquisite flow properties makes it ideal for use in potting and encapsulation applications.

Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product can be cured at temperatures as low as 80°C. Although superlative properties are obtained with higher temperature cures, good mechanical strength properties and dimensional stability are furnished by 80°C cures as well. KB 1613 R80 offers an extensive serviceable temperature range of -70°C to +180°C.

Discover our space approved epoxy system KB 1631 HTC-1 with the help of this infographic. It offers phenomenal thermal conductivity, cryogenic serviceability and it is capable of passing ASTM E-595 NASA standards for low outgassing.

Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

In addition to resins and curing agents, fillers are the most common ingredient in an adhesive formulation. Depending on the type of filler employed, it can have varied effects on the epoxy system. They can improve machinability, mechanical strength properties, corrosion resistance, thermal stability, abrasion resistance and dimensional stability. Specific fillers are capable of providing exceptional flame retardancy, heat dissipation properties and electrical conductivity.

Kohesi Bond KB-SS-G is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI), along with cost effectiveness. Shielding effectiveness is extremely critical for electronic devices, since energy from various appliances such as radios can interfere with their performance. Our conductive coatings are usually applied to housing substrates to protect the devices from any such interference.

Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in electronic and electrical applications. Choosing the right epoxy not only depends on its dielectric properties, but also on a number of properties such as temperature resistance, mechanical strength, chemical resistance and resistance to thermal and mechanical shocks and cycles.

Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals. In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customers application:

Epoxies make an excellent choice of material for space applications. However, selecting the right adhesive is extremely critical for the performance of various optical and electronic components in space. One of the key concerns while selecting an adhesive for space applications is its serviceability in extremely high vacuum environment. Systems operate under very high vacuum (~ 10^-8 torr) in space. Any outgassing from the adhesive could lead to failure of crucial components of the system.