Kohesi Bond’s UHV-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595) and can successfully operate at pressures up to 1 x 10-12 torr. One of the key concerns while selecting an adhesive for vacuum...
An unmanned aerial vehicle (UAV), most commonly known as a drone is an aircraft without the physical presence of a human pilot on the aircraft. It is a component of an unmanned aircraft system; which includes the UAV, a flight...
With the growing demand for wireless communications, the number of satellites being launched every year has more than doubled in the last decade. Satellites are launched into different orbits (low-Earth, medium-Earth and geostationary...
Liquid shims are epoxy-based pastes typically used to fill gaps encountered primarily in aircraft composite structures that allow better load transfer between mechanically fastened components. Key features to look for while selecting a...
Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. Using our extensive technical expertise, we offer these formulations with an array of performance and...
Electromagnetic and radio frequency interference damages your electronic devices by degrading their circuit’s performance or damaging them all together. Kohesi Bond’s engineers have developed first-rate epoxy and sodium...
Kohesi Bond has custom formulated adhesives, sealants, coatings, potting and impregnation compounds for successful use in the aerospace industry. These products are capable of passing strict industrial certifications, such as NASA...
Are you facing trouble with properly mixing a two component epoxy? Watch our latest technical tip to master the art of mixing epoxy adhesives! Video Transcript: Have you ever wondered how to thoroughly mix a two component epoxy system?...
Kohesi Bond has custom formulated adhesives, sealants, coatings, potting and impregnation compounds for successful use in the electronics industry. These products are widely used for conformal coating, die attach, glob top and wire...
PRODUCT RELEASE 21 September 2017 Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume....
PRODUCT RELEASE 12 September 2017 Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes...
PRODUCT RELEASE 31 August 2017 Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (Part A: Part B) mix ratio by...
ENHANCING ELECTRICAL INSULATION PROPERTIES OF EPOXIES 24 August 2017 Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in...
PRODUCT RELEASE 10 August 2017 Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only...
PRODUCT RELEASE – KB 1613 R80 03 August 2017 Epoxies make an excellent choice of material for space applications. However, selecting the right adhesive is extremely critical for the performance of various optical and electronic...
PRODUCT RELEASE – KB 1613 R80 16 May 2017 Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This product offers the highest level of...
PRODUCT RELEASE 09 May 2017 Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight....
PRODUCT RELEASE 02 May 2017 Kohesi Bond KB 1631 FR-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although KB 1631 FR-2 cures hard at...
PRODUCT RELEASE – KB 1613 R80 21 March 2017 Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any...
INFOGRAPHIC 06 April 2017 Discover our space approved epoxy system KB 1631 HTC-1 with the help of this infographic. It offers phenomenal thermal conductivity, cryogenic serviceability and it is capable of passing ASTM E-595 NASA...
PRODUCT RELEASE 04 April 2017 Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity...
ARTICLE: FILLERS FOR EPOXY RESINS 30 March 2017 In addition to resins and curing agents, fillers are the most common ingredient in an adhesive formulation. Depending on the type of filler employed, it can have varied effects on the...
PRODUCT RELEASE 28 March 2017 Kohesi Bond KB-SS-G is a graphite filled, sodium silicate based coating system. Firstly, this product offers very good electrical conductivity. This products offers high levels of shielding towards...
Technical Tip: Enhancing Electrical Insulation Properties for Epoxies 23 March 2017 Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely...
PRODUCT RELEASE 21 March 2017 Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In...
Do you need a potting compound that can flow into tiny spaces? Check out our latest infographic to learn more about our flowable potting compound KB 10473 FLAO. It offers superior thermal conductivity and a high degree of flexibility....
Discover our no-mix one component epoxy system KB 1613 HT designed to pass USP Class VI medical testing with the help of this infographic....
Many of Kohesi Bond’s medical grade epoxies are can resist numerous cycles of severe sterilization. This infographic gives you an overview of the various types of sterilizations and how they can affect your bonding, coating and...
A bonds performance is not only determined by the choice of the adhesive, but also by the surface preparation technique implemented. This can be achieved in a number of ways. Find out what surface preparation technique works best for...
Learn more about our newest cryogenic epoxy system KB 1039 CRLP with the help of this infographic. It can handle temperatures down to 4K (-269.15 ℃) and it is also capable of passing NASA standards for low outgassing (ASTM E-595)....
Discover our one component epoxy system KB 1427 HT that offers superior resistance to high temperatures and it is also capable of passing NASA standards for low outgassing (ASTM E-595), with the help of this infographic....
Discover our space approved epoxy system KB 1631 HTC-1 with the help of this infographic. It offers phenomenal thermal conductivity, cryogenic serviceability and it is capable of passing ASTM E-595 NASA standards for low outgassing....
Explore our sodium silicate based coatings that offer the superior protection against electromagnetic and radio-frequency interference (EMI/RFI) with the help of this infographic. KB-SS-SIL presents a silver filler that offers...
