KB 1427 HT
KB 1427 HT is a path-breaking one part epoxy used for bonding, sealing, coating and casting applications. It offers a roaring glass transition temperature Tg of 220°C – 230°C and stellar chemical resistance to a wide variety of fuels, oil and water.
KB 1613 HT
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
TUF 1613 HT-DA
TUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
KB 1151 S-1
KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
KB 1631 FR-2
KB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
KB 1631 HTC-1
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
Epoxy potting and encapsulation compounds are a type of thermosetting adhesive that consists of epoxy resin and hardener. They are the best type of adhesive for glueing metals, glass, concrete, ceramics, wood and many plastics. Epoxy systems provide strong adhesion to various surfaces due to polar attraction or direct bonds called the epoxide reactive process. It needs a curing agent and curing time to set into a solid state.
Epoxy adhesives are either one-component or two-component adhesives which are further classified based on their properties such as thermal curing, room temperature curing, viscosity hardness, working life, optically clarity etc.
Compared to other adhesive systems, epoxy adhesives offer some of the highest strengths along with superior resistance to chemicals and corrosion. Epoxies can also be used for casting or filling voids. Special grades offer high impact strength, good toughness, electrical and thermal conductivity, optical clarity, biocompatibility, cryogenic serviceability and flame retardance. The ability to modify an epoxy adhesive to meet specific end properties, makes it a versatile choice for most industrial applications.
Epoxy adhesives are highly versatile and are used in many industries due to their excellent bonding capabilities. Some of the common industries epoxy adhesives are used in are electronic, medical, optical, oil and chemical, automotive and aerospace among other industries. In addition to bonding, epoxy systems can also be used for sealing, coating, potting, encapsulation and impregnation applications.
You should make sure that the surface to be bonded with epoxy adhesive should be clean and dry. The surfaces need to be cleaned of any contamination such as dust, grease, oil, or wax with the help of the proper solvent. You can read our whitepaper on surface preparation to get a detailed insight on how to prepare various substrates.
The curing time is completely dependent on the choice of the epoxy adhesive. Fast curing systems can cure as quickly as 5 minutes, whereas slower curing systems can take much longer. To know the exact cure schedule of the epoxy adhesive you are using, kindly refer to the technical data sheet of the product.
Kohesi Bond is one of the leading suppliers and manufacturers of epoxy adhesives in India. Our high quality, tailor-made products can be directly purchased from us. All our products are made-to-order and shipped straight from our factory to your location globally. Contact our technical experts to find the right epoxy adhesive for your application!