KB 1031 AT-S
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
KB 1613 HT
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
Kohesi Bond is at the forefront of manufacturing one and two component epoxy and sodium silicate based systems, primarily formulated for the electronics and the electrical industries. These specially designed adhesives, sealants, coatings, potting and encapsulation compounds meet the highest quality standards. Also, they are capable of passing various industrial certifications such as NASA standards for low outgassing (ASTM E-595) and UL 94 V-0 for flame retardancy. Our superior products offer superior electrical and thermal properties. Specific grades offer first-rate electrical conductivity for shielding, wire bonding and grounding applications. They adhere well to similar and dissimilar substrates and provide excellent dimensional stability. Our products can withstand extremely high and low temperatures, harsh chemical environments and offer low coefficient of thermal expansion (CTE). We can tailor our products to match specific curing and flow properties. In addition, our easy to use packaging allows for minimal waste and can be readily used with automated dispensing machines.
Kohesi Bond is a pioneer in formulating and manufacturing epoxy and sodium silicate based systems for use in medical electronics. Our one and two component adhesives, sealants, coatings, potting and encapsulation compounds provide superior electrical insulation, adhesion to various substrates, withstand multiple sterilization cycles, hold up to extreme temperatures and chemicals and offer superior dimensional stability. Specific grades provide excellent electrical and/or thermal conductance. Our epoxies for medical electronics can also be used as conformal coatings, underfills and glob top coatings. Medical electronics encompasses a broad range of devices. Some typical applications include defibrillators, glucose monitors, stethoscopes, hearing aids, imaging devices, fingertip pulse oximeters, sphygmomanometers, neurostimulators, fetal monitors, heart monitors and electronic brain wave machines. Our specially tailor-made products meet your specific requirements for medical electronics.
Syringe needle assembly and bonding requires specialty products that can meet a number of requirements. Kohesi Bond formulates custom adhesives that meet your needle bonding specifications. Our adhesives are offered in a variety of viscosities that allow good flow of the adhesive between the cannula and the hub, and also hold it in place. Our adhesives provide ease of use and long working times, ideal for high volume production. We offer our products in dispensable syringes that work well with automated systems. Our products are capable of passing USP Class VI biocompatibility test. They can withstand multiple autoclaving, gamma radiation, EtO and other sterilization cycles. Kohesi Bond’s needle bonding adhesive systems provide excellent adhesion to various hub substrates and provide leak-proof bonds.
Kohesi Bond offers an extensive range of medical adhesives, sealants and coatings that are used in fabricating reusable and disposable medical devices. Our one and two component epoxy systems are capable of passing USP Class VI and ISA 10993-5 biocompatibility tests. They can withstand multiple cycles of steam autoclaving, radiation, ethylene oxide (EtO) and cold chemical sterilization. They provide superior bond strength, dimensional stability and resistance to high temperatures and harsh chemicals. They adhere well to similar as well as dissimilar substrates. Typical applications include catheters, imaging equipment, IV kits, surgical instruments, blood heat exchangers and endoscopes. Our products can be customized to meet your specific end requirements.
Kohesi Bond offers first-rate one and two component epoxies and sodium silicate based systems for use in medical diagnostic equipments. Our superior adhesives, sealants, coatings, potting and encapsulation compounds offer superior adhesion to similar as well as dissimilar substrates. In addition they can withstand multiple sterilization cycles, high temperatures, harsh chemicals and provide dimensionally stable bonds. They are capable of passing USP Class VI and ISO 10993-5 cytotoxicity tests. Specific grades offer electrical and/or thermal conductivity and are capable of passing NASA standards for low outgassing. We also offer optically clear products that provide phenomenal transmission properties. Kohesi Bond specializes in custom formulating products to your specifications.
Kohesi Bond’s USP Class VI compatible one and two component epoxy systems make an ideal fit for assembly of prosthetics and orthopaedic devices. Our adhesives, sealants and coatings offer superior toughness, mechanical strength, adhesion and dimensional stability. They can resist impact, mechanical fatigue and cyclic wear and tear without affecting its bonding properties. Our products adhere well to similar as well as dissimilar substrates, that are commonly used in prosthetic devices. We can package our products in easy to use, dispensable syringes. Also, we can tailor our products to meet your exact requirements.