KB 10473 FLAO
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
KB 1631 AOLV-1
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
TUF 1452 HT-2
Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass.
Kohesi Bond extensive range of one and two component epoxy systems are carefully designed for use in various OEM applications. Our products offer convenient cure schedules, easy-to-use mix ratios and varying viscosities to meet your requirements. The are also capable of handling extreme temperatures and chemical exposure. Our adhesives, sealants, coatings, potting and encapsulation compounds are commonly used filters, engines, cryogenic freezers, hydraulic components, pumps, transformers and semiconductor assemblies. They offer superior adhesion to similar as well as dissimilar substrates. Kohesi Bond specializes in customizing each product to specifically meet your end requirements. Also, we offer our products in easy to use packaging.