TUF 1452 HT-2

Product Description
Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

TUF 1452 HT-2 is a toughened system, offering low exotherm and a long working life. It can withstand multiple cycles of thermal and mechanical shocks. It offers an extensive serviceable temperature range of -60°C to +220°C. This phenomenal adhesive fosters outstanding physical strength properties as well as dimensional stability. It offers minimal shrinkage upon cure and is suitable for medium sized castings. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of acids, bases, solvents, fuels, oils and water. Part A has a tan-brown color and Part B has an amber color. TUF 1452 HT-2 is widely used in the electronics, aerospace and various OEM applications.
Product Highlights
   High glass transition temperature
   Resists thermal and mechanical shocks
   Very good flow properties
   Superior chemical resistance
   Exceptional electrical insulation properties
   Phenomenal toughness
Typical Applications
   Bonding
   Sealing
   Coating
   Potting
   Encapsulation
Packaging
TUF 1452 HT-2 can be packaged in various sizes and units to conform to your needs.
Certification