Chemical Resistance
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- Hydrochloric Acid
- Hydrofluoric Acid
- Nitric Acid
- Sulphuric Acid
- Phosphoric Acid
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- Potassium chloride
- Potassium hydroxide
- Sodium hydroxide
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- Methanol
- Ethanol
- Butanol
- Isopropanol
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- Acetone
- Toluene
- Methyl ethyl ketone (MEK)
- Carbon tetrachloride
- Heptane
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- JP4 & JP10 Jet Fuels
- Gasoline
- Gasohols
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- Steam autoclave
- Radiation
- Ethylene oxide (ETO)
- Hydrogen peroxide
- Peracetic acid
- Cidex
- Sterrad
- Glutaraldehyde
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KB 1040-2
KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
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KB 1048
Kohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 1151 S-1
KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
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KB 1372-LO
Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
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KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.