Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. We offer a sweeping range of first-rate epoxy and sodium silicate based systems designed specifically to be used as conformal coatings, glob tops, flip chips, underfills, and die-attach for semiconductor, microelectronics, printed circuit boards and other electronic applications. Browse our catalog to find the best solution for your application.
Kohesi Bond performance products are specially designed for successful use in the assembly of aircraft interiors, components, structures, satellites, MRO and other space applications. Our space-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595), UL 94V-0 and FAR standards for flame retardancy. Request our full catalog to find your space adhesive.