Impregnation of micropores in metals, ceramics, fibers and other materials requires low viscosity, stable and strong compounds. Kohesi Bond’s first-rate epoxies offer a choice of long open time, low viscosities, superior strength, dimensional stability and wide service temperature ranges. In addition the offer excellent chemical resistance and cure readily at elevated temperatures. Our products are commonly employed with glass and carbon fiber mats for use in aerospace, windmill and high-end electronics applications. We can customize our products to meet specific end user specifications.
Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.