Other

-
KB 1031 ATHT-LO
Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
-
TUF 1621 AOHT
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
-
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact.
FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Our adhesives, sealants and coatings are capable of passing this rigorous test and can be used for a more continued contact with food articles.
-
KB 1040 P
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
-
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
-
KB 10473 FL
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
TUF 1621 AOHT
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
-
TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
-
KB 1458 TC
Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns.
-
TUF 1828 TC
Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature.