adhesives for various industries
Kohesi Bond’s extensive line of performance adhesives, sealants, coatings, potting and encapsulation compounds are used in numerous other industries. We offer our products with an array of mechanical, optical, electrical, chemical, thermal and curing properties. Kohesi Bond specializes in tailoring products to precisely meet your end requirements. Our products are available in various packaging options, to offer ease of use and improve efficiency.

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Kohesi Bond specializes in formulating innovative adhesives, sealants, coatings, potting and encapsulation compounds for the automotive industry. Our advanced one and two component epoxy systems resist impact, shock, vibrations, extreme temperatures, variety of chemicals and abrasion. In addition, they offer superior bond strength and adhere extremely well to similar and dissimilar substrates. They are used in a variety of automotive applications, such as automotive interiors, exteriors, structural bonding, chassis and powertrain, automotive lighting and electronics, fuel tank and injection systems and acoustic management. We offer our adhesives in easy to use packaging that are compatible with automated dispensing machines.
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Kohesi Bond offers a variety of epoxy based, food safe products that are commonly used in the food industry. They can withstand various chemicals, oils, boiling water, freezing temperatures and resist abrasion. The U.S. Food and Drug Administration (FDA) has established two standards for adhesives that are intended for use in producing, manufacturing, packaging, processing, transporting or holding food. These two standards are specified as follows:

FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact.

FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Our adhesives, sealants and coatings are capable of passing this rigorous test and can be used for a more continued contact with food articles.
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The need for alternative and renewable sources of energy is growing rampantly. Kohesi Bond offers cutting edge solutions for alternate sources , such as solar, wind, hydropower and fuel cells. Our future ready adhesives, sealants, coatings, potting and encapsulation compounds offer first-rate performance in harsh environments. They can withstand extreme temperatures, pressures, chemicals, abrasion and mechanical stresses. Our one and two component epoxy systems offer a variety of curing options, electrical conductivity, thermal conductivity and high purity. Our high quality products are packaged for ease of use and application. They can be customized to meet your specific requirements.
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Kohesi Bond’s cutting edge research and development team is at the forefront of using the latest nanotechnological developments to advance our adhesives, sealants and coatings. Nanoparticle sized fillers such as ceramic powders, nanoclays, zeolites are used to provide improved performance properties and application in thinner sections. They offer better electrical stability, lower thermal resistance and improved mechanical strength. Our nanoparticle filled adhesives are used in semiconductor packaging, microelectronics, optical, optoelectronic and sensor applications. We can customize our products with different nano-fillers to meet your specific requirements.
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