KB 10473 FL

Product Description
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 10473 FL is optically clear and offers top notch light transmissions properties. It has a refractive index of 1.51. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks, even at cryogenic temperatures. It offers minimal shrinkage upon cure. KB 10473 FL adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part A and Part B are clear in color. KB 10473 FL is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where optical clarity, cryogenic serviceability and high flexibility are desired.
Product Highlights
   Superior optical clarity
   Excellent flow properties
   Phenomenal flexibility
   Very low exotherm
   ideal for casting
   Exceptional electrical insulation properties
   Resists mechanical and thermal shocks
Typical Applications
   Bonding
   Sealing
   Coating
   Potting
   Encapsulation
Packaging
KB 10473 FL can be packaged in various sizes and units to conform to your needs.
Certification