KB 1039 CRLP

Product Description
Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 – 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90°C for 3 – 5 hours.

KB 1039 CRLP is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is optically clear and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. This product offers first-rate optical clarity and cures rigid. KB 1039 CRLP is widely used in optical, optoelectronic, electronics and aerospace industries, where optical clarity, low outgassing and cryogenic serviceability are key requirements.
Product Highlights
   Superior optical clarity
   Very good flow properties
   Withstands cryogenic shocks and cycling
   Outstanding mechanical strength properties
   Excellent electrical insulation properties
   Capable of passing NASA low outgassing
Typical Applications
   Bonding
   Sealing
   Coating
   Potting
   Encapsulation
Packaging
KB 1039 CRLP can be packaged in various sizes and units to conform to your needs.
Certification