KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
Kohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This products offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI).
Kohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C.
KB 1613 RLV
Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
TUF 1613 HT-CM
Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
KB 1151 S-1
KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
KB 1427 HT-3
This product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C.
TUF 1613 HT-DA
TUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.