KB 1613 RLV

Product Description
Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 RLV offers an extensive serviceable temperature range of -50°C to +180°C. This product’s exquisite flow properties makes it ideal for use in underfill, potting and encapsulation applications. Being a one component system, it provides ease of application and also adheres well to an encyclopedic variety of substrates including metals, ceramics, most plastics and glass. It provides sterling mechanical strength properties and dimensional stability. KB 1613 RLV offers phenomenal thermal conductivity of 1 – 1.2 W/m/K. In addition to superior electrical insulation, KB 1613 RLV also offers astounding chemical resistance to a variety of fuels, oils and water. It has a light yellow color, but it can be color matched to your specifications upon request. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 RLV is widely used in electronics and microelectronics packaging and assembly applications.
Product Highlights
   Thermally conductive
   Castable up to 1 inch thicknesses
   Rapid cures at elevated temperatures
   Superior dimensional stability
   Exceptional electrical isolator
   Unlimited working life at room temperature
Typical Applications
   Underfill
   Potting
   Encapsulation
   Sealing
   Coating
Packaging
1/2 Pint Kits, Pint Kits, Quart Kits, Gallon Kits, 5 Gallon Kits
Certification