With the growing needs of the electronics industry, the challenge to protect and secure critical components is extremely important. This is typically performed by potting and sealing these components in a suitable housing. Kohesi Bond specializes in formulating superior epoxy based potting and sealing compounds for the electronics industry. Our products are used for potting of various electronic and microelectronic components, such as sensors, motors, coils, transformers, capacitors, switches, connectors, power supplies and cable harnesses among others.

Typical Requirements of a Potting/Sealing System: Superior dimensional stability Low exotherm Long working time Low shrinkage Stress-free cure Good thermal management Excellent electrical insulation properties Superior moisture resistance Advantages of Kohesi Bond Potting Systems: Thermal conductivity Good flow properties First-rate dielectric properties Low exotherm High glass transition temperature (Tg) Capable of passing NASA standards for low outgassing (ASTM E-595) Capable of passing USP Class VI Biocompatibility test Capable of passing UL 94V-0 and FAR 25.853 (a) flame retardancy tests Phenomenal chemical resistance