With the growing needs of the electronics industry, the challenge to protect and secure critical components is extremely important. This is typically performed by potting and sealing these components in a suitable housing. Kohesi Bond specializes in formulating superior epoxy based potting and sealing compounds for the electronics industry. Our products are used for potting of various electronic and microelectronic components, such as sensors, motors, coils, transformers, capacitors, switches, connectors, power supplies and cable harnesses among others.

Typical Requirements of a Potting/Sealing System:
Superior dimensional stability
Low exotherm
Long working time
Low shrinkage
Stress-free cure
Good thermal management
Excellent electrical insulation properties
Superior moisture resistance

Advantages of Kohesi Bond Potting Systems:
Thermal conductivity
Good flow properties
First-rate dielectric properties
Low exotherm
High glass transition temperature (Tg)
Capable of passing NASA standards for low outgassing (ASTM E-595)
Capable of passing USP Class VI Biocompatibility test
Capable of passing UL 94V-0 and FAR 25.853 (a) flame retardancy tests
Phenomenal chemical resistance