Advanced Properties of Adhesives, Sealants and Coatings

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low viscosity epoxy adhesive
 
Kohesi Bond tailor-makes adhesives, sealants, coatings, potting and encapsulation compounds in a wide range of viscosities. The flow properties range from very low (< 300 cps) to extremely high (> 1 million cps). We can design products to meet exact end use viscosity requirements. Low Viscosity products are extremely crucial in applications with tight clearances, gap filling, conformal coatings and impregnation applications. The excellent flow of the adhesive makes it easy to evenly fill gaps and uniformly coat substrates with consistent thickness. Their self levelling and gap filling properties make them ideal for use in casting or impregnating porous substrates. Medium Viscosity products provide uniform bond line along with easy of dispensing. They can be applied manually with a brush or even dispensed automatically from a syringe. These products are available as filled as well as unfilled systems. They conform extremely well to the different shapes and offer consistent process control. Non-drip Viscosity products are ideal for use on vertical surfaces and for large gap filling applications. They offer excellent process controlled and they can be customized to not flow even on addition of some heat. These systems offer excellent adhesion with any sagging.
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Kohesi Bond manufactures a wide range of adhesives, sealants, coatings, potting and encapsulation compounds that are available in varying hardnesses. The hardness of epoxies and related compounds is typically measured on a Shore scale. ASTM D2240 is the test standard that defines this test method. The product to be tested is first casted and then tested using either a Shore A or a Shore D hardness tester. Shore A hardness tester is typically used for softer materials, whereas Shore D tester is typically used for harder materials. Both Shore A and Shore D hardnesses range from 0 to 100 in an increasing order of hardness. Our products can be tailored to meet your exact hardness requirements.
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Abrasion refers to scratching or wearing or removing of a substance due to it being rubbed against a harder material. Kohesi Bond specializes in formulating abrasion and wear resistant epoxy based compounds. These coatings offer phenomenal resistance from fatigue and scuffing. This is typically achieved by filling the epoxy with highly abrasion resistant fillers. These products are widely used in the oil and gas industry, slurry lines, pipelines and vibrating screens. We can customize each product to meet exact specification requirements.
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Kohesi Bond’s dimensionally stable adhesives, sealants, coatings, potting and encapsulation compounds are designed for reliable and consistent performance in various industries. These products hold up to extreme temperatures, chemicals, shock, vibrations and yet maintain excellent adhesion. They are commonly employed in semiconductor and opto-electronic packaging, switch gears, potting of electrical sensors and similar applications.
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Kohesi Bond’s vibration, impact and shock resistant adhesives bond extremely well to similar and dissimilar substrates. These highly toughened systems offer excellent peel strength and can hold up well to repeated cycles of mechanical stress. Our one and two component adhesives, sealants and coatings are commonly used in aerospace, electronics, medical, automotive and oil and gas industries. These industries require the adhesive to bond well while holding up to periodic vibrations, shocks and impacts.
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Kohesi Bond manufactures an array of low stress adhesives that offer excellent elongation and a low modulus of elasticity. These epoxies are especially useful for bonding, sealing, coating or potting of sensitive components. Cracking and delamination during thermal cycling or mechanical loading occurs commonly between substrates with different coefficients of thermal expansion. Our low stress epoxy compounds offer excellent adhesion between similar and dissimilar substrates. They prevent stress cracking and fractures by dissipating the stress. In addition they offer low shrinkage, electrical and thermal conductivity, electrical and thermal insulation, chemical resistance and are capable of meeting various industrial standards. Our low stress epoxies are commonly used in electronic, electro-optic, optical fiber, photonic and optical industries.
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Kohesi Bond’s acoustic grade adhesives, sealants, coatings, potting and encapsulation compounds are frequently employed in sound dampening and amplification applications. Acoustic damping is critical in Hemholtz type resonators, noise canceling devices and sound proofing electronic applications. Rubberised epoxies offer ideal noise dampening properties. Other applications involving transducers and piezoelectronics used in underwater sonar, hearing aids and pulse receivers would require acoustic amplification. These special applications require very different types of filled epoxies. Kohesi Bond’s ceramic and metal filled epoxies offer first-rate acoustic amplification. Specialty fillers such as tungsten can also be used for this purpose. We can customize each product to meet exact specification requirements.
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