KB 1452 HT-2AO

Product Description
Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures.

KB 1452 HT-2AO offers an extensive serviceable temperature range of -70°C to +200°C. It is a phenomenal adhesive that offers outstanding physical strength properties and dimensional stability. KB 1452 HT-2AO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of organic and inorganic acids, solvents, alkalis, aromatic hydrocarbons, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its high thermal conductivity and very low CTE, KB 1452 HT-2AO is widely used in medical, electronics, aerospace, optical, semiconductor and various OEM applications requiring effective heat transfer capabilities.
Product Highlights
   Very high thermal conductivity
   Low coefficient of thermal expansion
   Castable up to 3 inches depth
   Outstanding chemical resistance
   Exceptional electrical insulation properties
   Very good flowability
Typical Applications
   Bonding
   Sealing
   Coating
   Encapsulation
   Potting
Packaging
KB 1452 HT-2AO can be packaged in various sizes and units to conform to your needs.
Certification