KB 1031 AT-2LO

Product Description
Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation. KB 1031 AT-2LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1031 AT-2LO is widely used in electronics and related industries.
Product Highlights
   Superior thermal conductivity
   Tremendous flexibility and elongation
   Cryogenically serviceable
   Soaring peel strength
   Exceptional electrical insulation properties
   Capable of passing NASA low outgassing
Typical Applications
   Bonding
   Sealing
   Coating
   Potting
   Encapsulation
Packaging
KB 1031 AT-2LO can be packaged in various sizes and units to conform to your needs.
Certification