KB 1031 ATFL-N

Product Description
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1031 ATFL-N can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is an outstanding adhesive that offers superb physical strength properties and elongation, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1031 ATFL-N adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a nickel color. Owing to its versatile performance, KB 1031 ATFL-N is widely used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications.
Product Highlights
   Easy mix ratio of 1:1 by weight or volume
   Outstanding flexibility
   Superior thermal conductivity
   High peel strength
   Nickel filled
   electrically conductive
   Cryogenically serviceable
Typical Applications
   Bonding
   Sealing
Packaging
KB 1031 ATFL-N can be packaged in various sizes and units to conform to your needs.
Certification