KB 10473 FLAO

Product Description
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 10473 FLAO is thermally conductive and offers top notch conductivity of 1.4 – 1.5 W/m/K. It is cryogenically serviceable and offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers minimal shrinkage upon cure. KB 10473 FLAO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part A and Part B are off-white in color. KB 10473 FLAO is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where excellent thermal conductivity, cryogenic serviceability and high flexibility are desired.
Product Highlights
   Superior thermal conductivity
   Excellent flow properties
   Phenomenal flexibility
   Very low exotherm
   ideal for casting
   Exceptional electrical insulation properties
   Capable of passing NASA low outgassing
Typical Applications
   Bonding
   Sealing
   Coating
   Potting
   Encapsulation
Packaging
KB 10473 FLAO can be packaged in various sizes and units to conform to your needs.
Certification