KB 1689

Product Description
Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1689 can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +135°C. It is an outstanding adhesive that offers superb bond strength, peel strength and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1689 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.8 – 2.3 W/m/K), it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a gray color. Owing to its versatile performance, KB 1689 is widely used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications.
Product Highlights
   Easy mix ratio of 1:1 by weight
   Outstanding toughness
   Superior thermal conductivity
   Cost effective
   Very low volume resistivity (< 0.005 ohm-cm)
   Cryogenically serviceable
Typical Applications
   Bonding
   Sealing
Packaging
KB 1689 can be packaged in various sizes and units to conform to your needs.
Certification