IS THERE A POTTING COMPOUND FOR CRYOGENIC, HIGH VACUUM APPLICATION?


Customer’s Application

The customer requires an epoxy potting compound for enclosing sensitive electronic components in an aluminum housing. These electronics are going to be used in space, under an extremely high vacuum environment.

Application Discussion

In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customer’s application:
1. What are the minimum and maximum temperatures that the adhesive will be exposed to?
2.Will you perform any thermal cycling tests? If yes, how many cycles, between what temperatures and what will the ramp speeds and dwell times be?
3.Do you require thermal conductivity?
4. Does the adhesive need to pass NASA standards for low outgassing (ASTM E-595)?

Product Recommendation

Based on answers to the above questions, Kohesi Bond’s technical expert recommended our product KB 1039 CRLP-AO. KB 1039 CRLP-AO is a two component, heat curing epoxy system. It offers a sweeping serviceable temperature range of 4K (-269.15°C) to +120°C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers a very low coefficient of thermal expansion (CTE) of 20 – 25 ppm/°C. KB 1039 CRLP-AO also offers very good thermal conductivity (> 1.4 W/m/K) and it is capable of passing NASA standards for low outgassing (ASTM E-595). Additionally, this product cures rigid, offers very good flow properties and a low exotherm. A unique combination of these properties makes KB 1039 CRLP-AO ideal for potting applications and high vacuum environments. Our customer successfully tested KB 1039 CRLP-AO in their application and got excellent results.