KB 1040 AN-1

Product Description
Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. Its stellar heat transfer capabilities and flow characteristics make it fitting for potting applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 1040 AN-1 can withstand severe thermal cycling and provides superior physical strength properties and dimensional stability. It offers an extensive serviceable temperature range of -50°C to +120°C. KB 1040 AN-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has a clear color. Owing to its remarkable performance and vacuum compatibility KB 1040 AN-1 is widely used in aerospace, electronics and related industries.
Product Highlights
   Superior thermal conductivity
   Very low coefficient of thermal expansion
   Phenomenal dimensional stability
   Excellent flow properties
   Outstanding electrical insulation properties
   Capable of passing NASA low outgassing
Typical Applications
   Bonding
   Sealing
   Coating
   Potting
   Encapsulation
Packaging
KB 1040 AN-1 can be packaged in various sizes and units to conform to your needs.
Certification