Reducing Cycle Times by 200% with Fast-Cure Potting Solutions for Industrial Controls

The Kohesi Bond Solution | Custom Engineered Certainty

The solution required an epoxy system where the cure kinetics were engineered specifically for manufacturing speed and process control.

• Fast Cure Speed: To maximise manufacturing throughput, rapid cure cycles are achieved through specialised technologies such as heat-activated “snap-cure”, UV-curable, hybrid dual-cure systems, or pre-mixed and frozen (PMF) epoxies. These fast-cure potting compounds allow for “on-demand” polymerization or ultra-fast thermal processing, effectively eliminating production bottlenecks and reducing work-in-progress. However, manufacturers must balance these gains in speed against the significant capital investment for UV-curing hardware or the logistical complexities and energy costs associated with maintaining -40°C storage for frozen materials.
• One-Component (1K) System: A one-component, heat-curable system is ideally suited for high-speed automated lines, as it eliminates the complexity of meter-mix-dispense hardware and the associated risk of off-ratio mixing errors. Furthermore, these formulations offer an unlimited open time at room temperature, providing manufacturers with greater operational flexibility and reducing material waste during assembly pauses.
• Optimised Viscosity for Dispensing: The epoxy’s viscosity and rheology must be precisely controlled and consistent from batch to batch to ensure that automated dispensing robots can lay down an accurate, repeatable amount of material at high speed without issues like stringing or dripping.
• Uncompromising Environmental Resilience: While production speed is critical, industrial potting compounds must be engineered to withstand the rigorous operating parameters of the final industrial control unit. This ensures that the rapid cure cycle does not compromise the material’s ability to protect sensitive electronics against thermal fluctuations, mechanical fatigue, and environmental contaminants over a long service life.

• Thermal and Mechanical Stability: The cured epoxy must maintain its structural integrity and dielectric properties across the device’s full operating temperature range (typically -40°C to +120°C or higher). It must provide excellent vibration dampening and shock resistance to protect delicate components from the mechanical stresses common in industrial machinery.
• Low Stress and Shrinkage: High-speed curing can sometimes lead to internal stresses; therefore, the formulation must exhibit exceptionally low shrinkage upon curing. This prevents stress-induced damage to fragile surface-mount components or solder joints, ensuring the long-term reliability of the control module and the effectiveness of the electronic encapsulation materials.
• Chemical and Moisture Protection: Industrial controls are often exposed to humidity, oils, and cleaning solvents. The potting compound must act as a superior barrier, offering low water absorption and high chemical resistance to prevent corrosion and electrical leakage throughout the component’s life cycle.

To optimise high-volume manufacturing lines, Kohesi Bond’s experts recommended KB 1615 FC, a high-performance, one-part heat-cured epoxy adhesive designed for seamless integration into automated assembly. As a single-component system, it eliminates the need for complex meter-mix-dispense equipment and removes the risk of off-ratio mixing errors, ensuring consistent material properties across thousands of units. A standout feature of this system is its versatile cure profile: it can achieve a full cure at temperatures as low as 80°C – ideal for heat-sensitive sensors – or a rapid “snap-cure” at 150°C in under 10 minutes for maximum throughput. Furthermore, KB 1615 FC offers an exceptionally long working life at room temperature, providing operational flexibility without the logistical burden or energy costs associated with frozen storage.

Engineered specifically for the rigorous service conditions of potting compounds for industrial controls, KB 1615 FC delivers superior thermal stability and uncompromising dielectric strength, even under sustained operational heat. Its low-shrinkage formulation is critical for protecting delicate surface-mount components and solder joints from mechanical fatigue, while its robust chemical resistance safeguards electronics against moisture, oils, and industrial contaminants. This material forms a tenacious, permanent bond to a wide variety of substrates, including metals and high-temperature plastics, ensuring a durable hermetic seal through intense vibration and thermal cycling. In epoxy potting for PCBs, KB 1615 FC provides the reliable, high-efficiency foundation required for the next generation of industrial automation and control systems.

The Result

By transitioning to KB 1615 FC, the client revolutionised their manufacturing process, reducing the potting cure time from 24 hours to a rapid, high-temperature snap-cure. This transformation eliminated the primary production bottleneck, enabling a 200% increase in factory output within the existing facility footprint. The move to a single-component system also removed the complexities of manual mixing and meter-mix equipment, drastically improving process repeatability and reducing the defect rates associated with off-ratio errors.

Beyond the immediate speed gains, the elimination of lengthy curing cycles freed up significant factory floor space previously dedicated to work-in-progress (WIP) storage. This shift allowed the manufacturer to leverage their automation investment to its full potential, transitioning from an inefficient batch process to a lean, continuous flow model. Ultimately, KB 1615 FC provided more than just a faster adhesive; it delivered a scalable manufacturing system that minimised operational overhead and maximised production ROI.

Production Impact

• Cure Time: Reduced from 24 hours to < 10 minutes.
• Work-in-Progress (WIP): 80% reduction in floor space for drying racks.
• Throughput: Increased production capacity by 3x.

Technical Specifications Summary