With the growing demand for wireless communications, the number of satellites being launched every year has more than doubled in the last decade. Satellites are launched into different orbits (low-Earth, medium-Earth and geostationary orbits) around our planet for various civil and military applications, including Earth observation, communication, navigation and weather information. A number of satellites are also launched into deeper space to orbit other bodies for scientific research.
Space provides an environment that is completely different than that on Earth. Lack of atmospheric protection in space means satellites, space probes and spacecrafts could be exposed to extremely hot and cold environments, high vacuum conditions, particulate radiation (electrons, protons, heavy ions) and highly reactive atomic oxygen. In addition to environmental factors, they are also susceptible to severe shocks, vibrations and mechanical loads. Polymeric compounds are widely used on satellites, spacecrafts and subsystems for structural and mechanical bonding, staking, coating, sealing, potting, encapsulation and fiber impregnation applications. Whether directly exposed to space or not, they must perform accurately without degradation.
Requirements for Space Adhesives :
- Combat highly reactive Atomic Oxygen (AO)
- Operate at cryogenic temperatures (4K)
- Effectively work under ultra high vacuum (UHV) conditions
- Pass NASA low outgassing standards (ASTM E-595)
- Must not cloud optical mirrors or lenses
- Maintain circuit continuity without contaminating precision components
- Withstand extreme thermal and mechanical shocks
Advantages of Kohesi Bond Space Grade Products :
Kohesi Bond is the first to successfully formulate and manufacture space grade, vacuum compatible epoxy, polyimide and sodium silicate based compounds in India. Not only are they capable of passing NASA low outgassing standards, but can also securely operate over a wide range of temperatures. Numerous Kohesi Bond one- and two-part systems have been effectively employed for manufacture of various space components, sensors, satellites, ultra high vacuum assemblies, optical systems and cryopumps.
- Can securely operate over a wide temperature range (4K to over 815°C)
- Easily withstands cryogenic shocks
- Capable of passing NASA standards for low outgassing (ASTM E-595)
- Superior mechanical strength and dimensional stability
- Phenomenal thermal conductivity (> 3.4 W/m/K)
- Superior electrical conductivity (< 0.001 ohm-cm)
- First-rate optical clarity
KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
KB 1631 HTC-1
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.