Case Study: Bonding Electronic Components Using Fast Curing Adhesives

Case Study: Bonding Electronic Components Using Fast Curing Adhesives 10 August 2017

The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals. In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customers application: