Kohesi bond’s technical experts come across a wide range of applications. Each application is unique and so are their requirements. Read our factual case studies to uncover answers and product recommendations for various bonding, coating, sealing, potting and encapsulation applications.
Is there a medical grade adhesive that can withstand steam sterilization?
Customer’s Application
The customer wants to bond to steel substrates to build a surgical instrument. The device will see high temperatures and steam sterilization.
Application Discussion
In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customer’s application:
1. Is this a disposable device or a reusable device?
2. How many steam sterilization cycles will the adhesive be exposed to?
3. Apart from sterilization, what is the maximum temperature that the instrument will see?
4. What viscosity are you looking for?
1. Is this a disposable device or a reusable device?
2. How many steam sterilization cycles will the adhesive be exposed to?
3. Apart from sterilization, what is the maximum temperature that the instrument will see?
4. What viscosity are you looking for?
Product Recommendation
Based on answers to the above questions, Kohesi Bond’s technical expert recommended our product KB 1452 HT-2.
KB 1452 HT-2 is a two component, room temperature curing epoxy system. It offers superior chemical resistance and it is capable of passing USP Class VI testing. Additionally, it has been tested to hold up to hundreds of steam sterilization cycles. The operating temperature ranges from -50°C to +230°C. Along with good flow properties, this product can be casted up to 3 inches depth. It offers first-rate mechanical strength properties and adheres superbly to steel substrates. It offers tensile strength of > 12,500 psi.
Our customer successfully tested KB 1452 HT-2 in their application and got excellent results.
Our customer successfully tested KB 1452 HT-2 in their application and got excellent results.
Bonding Electronic Components Using Fast Curing Adhesives
Customer’s Application
The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals.
Application Discussion
In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customer’s application:
1. What is the bonding area?
2. What are the operating temperatures?
3. What chemicals does the adhesive need to withstand? How will the exposure take place? How long at a time and how many times will the adhesive be exposed to these chemicals?
4. What are the pot life and cure time requirements?
1. What is the bonding area?
2. What are the operating temperatures?
3. What chemicals does the adhesive need to withstand? How will the exposure take place? How long at a time and how many times will the adhesive be exposed to these chemicals?
4. What are the pot life and cure time requirements?
Product Recommendation
Based on answers to the above questions, Kohesi Bond’s technical expert recommended our product KB 1427 HT-3. KB 1427 HT-3 is a one component, heat curing epoxy system. It offers superior chemical resistance, dimensional stability and extremely low shrinkage upon cure. Additionally, it offers first-rate electrical insulation properties. The operating temperature ranges from -50°C to +200°C. Along with good thermal cycling resistance, this product sets-up in a few seconds and cures completely in 3-5 minutes at elevated temperatures . It offers first-rate mechanical strength properties and adheres superbly to PCB substrates. It offers a glass transition temperature (Tg) of > 120°C.
Our customer successfully tested KB 1427HT-3 in their application and got excellent results.
Our customer successfully tested KB 1427HT-3 in their application and got excellent results.
Is There A Fast Setting Epoxy That Is Resistant to Acetone?
Customer’s Application
The customer wants to bond EUV optical substrates for lithography, where the epoxy will be exposed to immersion in acetone during cleaning. Additionally, they need the epoxy to set up relatively quickly.
Application Discussion
In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customer’s application:
1. What viscosity are you looking for?
2. What are the operating temperatures?
3. At what temperature will the exposure to acetone take place? How long at a time and how many times will the adhesive be exposed to acetone?
4. How quickly do you require the adhesive to set up?
1. What viscosity are you looking for?
2. What are the operating temperatures?
3. At what temperature will the exposure to acetone take place? How long at a time and how many times will the adhesive be exposed to acetone?
4. How quickly do you require the adhesive to set up?
Product Recommendation
Based on answers to the above questions, Kohesi Bond’s technical expert recommended our product KB 1151 S-1. KB 1151 S-1 is a two-component, room temperature curing epoxy system. It offers superior resistance to various solvents, including acetone. It has been tested for immersion in various chemicals, such as toluene, gasoline, ethylene glycol and others for over a year without failure. The operating temperature ranges from -50°C to +150°C. Along with good chemical resistance, this product can quickly set-up at room temperature (~ 20 minutes). It offers excellent mechanical strength properties and dimensional stability. KB 1151 S-1 offers good flow properties. However, KB 1151 S-1 can be formulated in non-drip viscosity and also for higher temperature resistance.
Our customer successfully tested KB 1151 S-1 in their application and got excellent results.
Our customer successfully tested KB 1151 S-1 in their application and got excellent results.
