Kohesi bond’s technical tip library offers answers to most common questions related to bonding, sealing, coating, potting and encapsulation. In addition, they provide guidance on achieving better strength, higher production efficiency and tips on ease of application. Get the most out of first-rate adhesive systems, by referring to Kohesi Bond’s technical tips.
The Solderless Revolution: Exploring Electrically Conductive Adhesives for Microelectronic Packaging
Microelectronic packaging now requires fine-pitch interconnects, high reliability, and aggressive miniaturisation. The move toward lead-free processes and RoHS compliance has