PRODUCT RELEASE 21 September 2017 Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications.KB 1631 ANHT […]
Read More →PRODUCT RELEASE 12 September 2017 Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures. TUF 1820 AOHT offers a sweeping serviceable temperature […]
Read More →PRODUCT RELEASE 31 August 2017 Kohesi Bond KB 1040-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating and encapsulating applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. The highlight of this products is its superior optical clarity and its capability of passing NASA […]
Read More →ENHANCING ELECTRICAL INSULATION PROPERTIES OF EPOXIES 24 August 2017 Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in electronic and electrical applications. Choosing the right epoxy not only depends on its dielectric properties, but also on a number of properties such as temperature resistance, mechanical strength, […]
Read More →PRODUCT RELEASE 10 August 2017 Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room temperature. It […]
Read More →PRODUCT RELEASE – KB 1613 R80 03 August 2017 Epoxies make an excellent choice of material for space applications. However, selecting the right adhesive is extremely critical for the performance of various optical and electronic components in space. One of the key concerns while selecting an adhesive for space applications is its serviceability in extremely […]
Read More →PRODUCT RELEASE – KB 1613 R80 16 May 2017 Kohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This product offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI). Shielding effectiveness is extremely critical for electronic devices since energy […]
Read More →PRODUCT RELEASE 09 May 2017 Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most […]
Read More →PRODUCT RELEASE 02 May 2017 Kohesi Bond KB 1631 FR-2 is a two component, room temperature curing epoxy system. This flame retardant epoxy generates low smoke and contains a non-halogenated filler. Although KB 1631 FR-2 cures hard at room temperature, the optimum cure schedule would be an overnight room temperature set-up followed by an addition […]
Read More →PRODUCT RELEASE – KB 1613 R80 21 March 2017 Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product […]
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