We engineer substrate-specific epoxy bonding systems that replace mechanical fasteners and welding across aerospace, defence, electronics, and industrial manufacturing.
Discover our comprehensive range of custom-formulated epoxy bonding adhesives designed for superior strength and performance in demanding industrial applications. For advanced bonding solutions, explore our product line below.
Purpose-engineered bonding systems that solve what mechanical fasteners cannot: continuous load distribution, thermal mismatch management, and process-controlled bond integrity.
Our advanced toughened bonding compound formulations absorb differential thermal strain at the interface, preventing cohesive failure across metal-to-composite joints through thousands of thermal cycles.
Our adhesive bonding systems are formulated to balance load transfer efficiency with elongation at break, delivering lap shear strength above 12 MPa without sacrificing thermal mismatch compliance.
Every Kohesi Bond recommendation optimises the adhesive bonding process through strict control of two critical variables. We verify surface preparation protocols above 40 mJ/m² and maintain bond line thickness between 100 and 250 µm for consistent joint performance.
Our epoxy bonding agent systems are verified against quantified metrics across three performance domains. Every system ships with full TDS data.Â
Our structural systems deliver dry lap shear from 15 to 40 MPa with conditioned retention above 80% after environmental exposure. Every qualified bond material is tested per ASTM D1002 and ASTM D1876.
Our R&D team qualifies bonding material performance from -196°C to above 200°C service temperatures. Tg is formulated to exceed the maximum service temperature by a minimum of 25°C, preventing bond line creep under sustained load.
Our formulations deliver less than a 20% lap shear reduction after 500 hours immersion in aviation fuel, hydraulic fluid, and phosphoric acid. Application-specific fluid compatibility testing is available before the bonding process is finalised.
Partner with our experts to develop custom engineered structural bonding adhesives,
tested to your exact application requirements.
Access comprehensive technical documentation and expert support to ensure optimal performance in your structural bonding applications.
One adhesive chemistry does not bond every substrate reliably. Kohesi Bond’s bonding epoxy systems are
formulated substrate-first,with qualification data to match.
Our metal bonding epoxy systems deliver structural joining of aluminium, stainless steel, titanium, and copper alloys. Conditioned lap shear retention stays above 80% after 1,000 hours at 70°C and 95% RH.Â
Our plastic bonding epoxy formulations achieve reliable crosslinked adhesion on PEEK, polycarbonate, and nylon without primers. Lap shear strengths of 8 to 15 MPa are achieved using this targeted structural bonding adhesive approach following plasma or chemical etch surface activation.
Our ceramic bonding epoxy systems provide low-shrinkage joining of Alumina (Al2O3), Zirconia (ZrO2), and glass-to-metal assemblies. Cure shrinkage stays below 1%, flexural modulus above 6 GPa, and void content is verified to be below 2% to ensure strict structural bonding adhesive integrity.
Our toughened elastomer-to-rigid substrate systems are calibrated to transfer shear load without generating bond edge peel stress. Peel strength up to 150 N/25 mm is achieved on EPDM and neoprene substrates.
| Parameter | One-Component Epoxy | Two-Component Epoxy |
|---|---|---|
| Cure trigger | Heat: 120°C to 250°C | Mixed hardener: Room Temperature (23°C to 80°C) |
| Pot life | Unlimited (store at or below room temperature (23°C)) | 5 min to 8 hours post-mix |
| Lap shear strength | 20 to 35 MPa | 25 to 40 MPa |
| Tg after cure | 140°C to 300°C+ | 60°C to 150°C |
| Best fit | Automated production, oven or autoclave | Field repair, prototype, manual assembly |
| TDS | Download per product | Download per product |
The right bonding epoxy format is determined by your cure process constraints and performance targets, not preference.
One-component systems deliver higher Tg but require the full assembly to reach cure temperature uniformly. One-component epoxy and two-part epoxy adhesive product TDS documentation is available on request from Kohesi Bond.
Protect what matters most. Our potting and encapsulation compounds shield sensitive components from moisture, vibration, and thermal stress, ensuring long-term reliability in the harshest operating environments.
Ensure leak-proof performance. Our advanced sealing compounds provide a reliable, long-lasting seal between a variety of similar and dissimilar substrates.
Achieve a flawless composite structure. Our resins fully saturate fiber composites, eliminating voids and air pockets for maximum strength and a high-quality finish.
Protect your surfaces. Our specialised coatings provide a protective barrier against heat, corrosion, and chemicals, enhancing performance and extending product life.
A qualified structural bonding adhesive retains over 80% of its strength after real-world exposure to heat, humidity, and fluids, not just in dry lab conditions. We test every formulation against the actual service environment your joint will face.
Our epoxy bonding agent formulations act as a compliant interlayer, absorbing thermal strain at the bond line instead of transferring it to the substrate as peel stress. Toughened systems extend this capacity without sacrificing load transfer efficiency.
Our metal bonding epoxy systems bond aluminium, titanium, stainless steel, copper, and mixed-metal assemblies with substrate-matched surface preparation. We provide preparation protocols alongside every adhesive data sheet to ensure bond durability.
Choose a one-component when your assembly reaches 120°C to 180°C uniformly and you need maximum Tg and lap shear. Choose a two-part bonding epoxy when cure temperature is constrained or part geometry rules out uniform oven cure.