Introduction to Kohesi Bond

Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. Using our extensive technical expertise, we offer these formulations with an array of performance and curing characteristics. Our unique ability to tailor products to each application’s specific needs, offers customers with reliable solutions and the ease of manufacturing.

Kohesi Bond is a pioneer in manufacturing first-rate adhesives, sealants, coatings, potting and encapsulation compounds. Our adhesives are capable of meeting highest quality standards and strict industrial certifications. Kohesi Bond custom formulates products to meet precise processing and performance requirements. Our technical team provides one-on-one support and works with you on every step of your application. Kohesi Bond products are proudly manufactured in India. Contact us today to discuss your application.

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Recent Blogs

Chemical-resistant potting compound for oil and gas sensors by Kohesi Bond

Defying Extreme Downhole Conditions: High-Performance Chemical-Resistant Potting Compound For Critical Oil & Gas Sensors

Customer’s Application The client is a global oilfield services company that designs, manufactures, and operates…
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Thermally conductive potting compound applied on high-density PCB for heat dissipation solution

Solving Critical Heat Dissipation Challenges In High-Density PCBs With Thermally Conductive Potting Compound

Customer’s Application The client is a manufacturer of industrial electronics, specialising in the design of…
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Case Study 1 USP Class VI Epoxy 1

USP Class VI Epoxy Enables Biocompatible Implantable Sensor

Customer’s Application The client is an innovative medical technology startup focused on developing a next-generation…
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Optimising epoxy curing temperature and time for Kohesi Bond adhesives.

The Art of Curing: Optimising Temperature & Time for Kohesi Bond Epoxies

Picture this: an aerospace adhesive joint separating mid-flight because incomplete crosslinking left nearly a third…
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