Customer’s Application The customer wants to bond EUV optical substrates for lithography, where the epoxy will be exposed to immersion in acetone during cleaning. Additionally,
Customer’s Application The customer wants to bond to steel substrates to build a surgical instrument. The device will see high temperatures and steam sterilization. Application
Besides resin and curing agent, fillers are the most common ingredient in an adhesive formulation. Depending on the type of filler employed, it can have
Thermosetting polymers, when heated, do not start melting. They turn into a viscous rubbery phase over a short temperature range; this sets them apart from
Discover our one component epoxy system KB 1427 HT that offers superior resistance to high temperatures and it is also capable of passing NASA standards
