Kohesi Bond manufactures both electrically insulative and electrically conductive epoxy adhesives, engineered to deliver precise electrical adhesive performance. Depending on your design, that means isolating sensitive components from an electrical path or creating a reliable, low-resistivity conductive bond.
Discover our comprehensive range of custom-formulated epoxy adhesives designed for superior biocompatibility and performance in demanding medical device applications. For advanced healthcare bonding solutions, explore our product line below.
Our electrical-property portfolio covers the full spectrum from maximum insulation to maximum conductivity, with every formulation tested to relevant electrical standards and available with full technical data sheet reporting. Whether you need a dielectric adhesive for isolation or a conductive epoxy for a current path, both come from the same qualified product family.
Because autoclave moisture and gamma radiation degrade epoxies through completely different mechanisms, our technical team validates every medical epoxy against your exact sterilisation method and cycle count before specification.
Source both extreme insulative 10¹⁴ and highly conductive 10⁻⁴ formulations within a single verified product family. Streamline your vendor qualification process by consolidating your electrical adhesive needs under one engineering team.
We report exact dielectric strength and volume resistivity data measured strictly to ASTM D149, ASTM D257, and relevant MIL-STD standards. You receive certified, batch-specific test values rather than generic or estimated baseline figures.
When off-the-shelf grades miss your target dielectric constant, dissipation factor, or frequency response, our R&D team formulates a custom system. We tune filler loading, rheology, and resin chemistry around your specific electrical and dispensing parameters.
Electrical properties are tested and validated across your full operating temperature range—from cryogenic environments up to 300°C. This ensures your bond maintains its insulation resistance or conductivity through severe thermal cycling without dielectric breakdown.
Get a formulation matched to your resistivity, dielectric strength or thermal conductivity target.
Select Kohesi Bond grades hold stable electrical properties from cryogenic temperatures near 4 K to elevated temperatures above 300°C, but that stability is grade-specific, not catalogue-wide. Confirm the performance curve for your exact operating range before you specify.
Our electrical adhesive systems are trusted across power electronics, PCB assembly, semiconductor packaging, aerospace and medical device manufacturing. They’re the first choice when electrical isolation or conductive epoxy performance is a primary design requirement.
Access comprehensive technical documentation and expert support to ensure optimal performance in your medical device bonding applications.
Each application below covers a specific electrical property in depth, with targeted formulation guidance.
Our high-dielectric epoxy formulations protect your sensitive circuitry from arc-over and electrical leaks while actively dissipating heat through specialised alumina and boron nitride fillers.
Our custom silver, nickel, and carbon-filled adhesive solutions reliably bridge critical circuits, replace heat-damaging solder, and deliver targeted EMI shielding tuned to your exact resistivity.
Filling out the form below will send your inquiry directly to Kohesi Bond’s technical support department.
An electrically insulating epoxy blocks current flow to a volume resistivity above 10¹⁴, letting it sit next to a live circuit without becoming part of it. An electrically conductive epoxy resin carries current instead, using silver, nickel, or carbon fillers loaded at high concentrations. Base epoxy resin is inherently an insulator—conductivity is added, so filler type and loading dictate where a formulation lands on the spectrum.
Yes, power electronics and LED assemblies frequently require moving heat away from a component without creating a new current path. These formulations use ceramic fillers like alumina or boron nitride instead of the metal fillers used in an electrically conductive epoxy resin. The trade-off is processability—high filler loading can make the adhesive harder to dispense at fine gaps.
We report the dielectric strength of epoxy adhesives to ASTM D149 at 23°C on a defined sample thickness and volume resistivity to ASTM D257. Dielectric strength scales inversely with thickness, so a number without a stated thickness isn’t comparable across data sheets. Where your application calls for it, we also test to relevant IEC and MIL-STD electrical methods.
Less stable than a data sheet implies if the only figure quoted is the 23°C number, as heat increases ionic and electronic mobility in the resin matrix. Select grades maintain stable electrical properties from cryogenic temperatures near 4 K to continuous operating temperatures above 300°C, which are verified by grade-specific test data. Confirm the performance curve for your exact operating range and exposure duration with our technical team before specifying.
Yes, where a standard grade misses your target resistivity, dielectric strength of epoxy, or frequency response, our R&D team adjusts filler loading and resin system to hit it. Share your target value, validation test method, and processing constraints like viscosity or cure profile. We formulate for that exact target rather than asking you to compromise toward a standard grade.
It depends on the shielding effectiveness you need against the cost you can absorb. Silver-filled epoxy gives the lowest resistivity and best broad-frequency shielding but at a higher cost and a risk of electrochemical migration in humid environments under DC bias, which is conductor spacing- and encapsulation-dependent. Carbon-filled systems cost less and provide a non-magnetic bond—ideal for general static dissipation and lower-frequency EMI shielding.