Two-component epoxy adhesives play an important role in advanced manufacturing systems because they offer precision formulation control, structural reliability, and strong internal resistance to challenging operational conditions.
As they can be formulated for specific properties, they’re an integral part of multiple sectors such as electronics, medical devices, aerospacex`, and high-performance OEM applications. In this blog, we outline their key characteristics, chemistry, and ideal industry use cases.
A] Understanding Two-Component Epoxy Adhesives
Two-component epoxy adhesives are made up of a resin agent and a curing agent. When mixed in the correct, pre-specified ratio, it triggers a polymerisation reaction.
This leads to the formation of cross-linked structures that have advanced chemical, mechanical, and thermal properties. As they’re engineered for temperature-assisted as well as heat-assisted curing schedules, they offer superior processing flexibility.
B] Characteristics of Two-Component Epoxy Systems
Our two-component epoxy formulations have been designed to adhere to and solve stringent application demands. Their key characteristics include:
- Customisation Flexibility: These formulation systems have been developed with the help of fillers like graphite, aluminium oxide, or quartz. This enhances their dielectric strength, thermal conductivity, or EMI shielding depending upon consumer-specific parameters.
- Thermal Resistance: Select products, such as KB 1372 LP, possess extremely high thermal stability. This makes them compatible for temperature environments that extend up to 230°C.
KB 1372 LP
Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight.
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- Chemical Resistance: The majority of our Kohesi Bond adhesives remain stable despite exposure to solvents, acids, fuels, and alkalis. This ensures longer-term performance even in chemically aggressive environments. However, products like KB 1151 S-1 and KB 1452 HT-2 offer the highest level of chemical resistance amongst epoxies.
KB 1151 S-1
Kohesi Bond KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:30 (Part A: Part B) mix ratio by weight.
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KB 1452 HT-2
Kohesi Bond KB 1452 HT-2 is a two component, room temperature curing, medical grade epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume.
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- Cure Profile Variability: Cure times and pot life can be fine-tuned to adjusting catalyst systems. This allows for more customisability for high-performance production lines over extended work durations.
Also Read: One-Part Epoxy Vs Two-Part Epoxy — What is The Best Epoxy Adhesive?
C] Industrial Applications of Two-Component Epoxies
1. Aerospace
We supply low-outgassing epoxy systems that are certified with NASA’s ASTM E-595 standard, such as our KB 1031 AT‑2LO variant. These systems are specifically engineered for:
- Composite structures
- Aerospace electronics
- Metal-to-metal bonding
They are also known to deliver optimum mechanical strength, weight savings and thermal cycling resistance, making them ideal for two-component epoxy for metal and aerospace bonding needs.
KB 1031 AT-2LO
Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight.
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2. Electronics & Electrical
KB 1031 ATFL-N (nickel-filled and electrically conductive) is used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications. It has a serviceable temperature range of -269.15°C to +120°C. It offers excellent conductivity and chemical resistance.
KB 1031 ATFL-N
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume.
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3. Medical Devices
Our USP Class VI and ISO 10993-5 compliant adhesives are used for bonding metals, plastics, and ceramics used in wearables, surgical instruments, and diagnostic services. They maintain output performance levels over repeated sterilisation cycles, including gamma radiation, autoclaving, and EtO treatments. A good example is KB 1452 HT-2 (Medical Grade), a reliable two-component adhesive for sensitive medical applications.
4. Optical & Photonics
KB 1040 P is an optical-grade formulation that is employed in the production of LEDs, sensors, and fiber optic assemblies due to its properties of low shrinkage and clarity. Additionally, it possesses high transparency and advanced resistance to UV exposure and yellowing.
5. OEM Applications
Two-part structural epoxies like TUF 1820 AOHT and KB 1040 P are employed in bonding plastics, metals, composites, and ceramics. Their inclusion enables greater mechanical integrity without the use of fasteners and has wide-ranging applications from industrial instrumentation to power electronics. Therefore, they are considered ideal solutions for two-component epoxy automotive applications as well as two-part epoxy for metal assemblies.
TUF 1820 AOHT
Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120°C and even faster at higher temperatures.
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D] Best Practices for Applying Two-Component Epoxies
1. Mixing
The correct mix ratio adherence is paramount to achieve full polymer crosslinking. This ensures long-term thermal and mechanical performance. For example, Kohesi Bond’s KB 1031 AT‑2LO is mixed at a 1:3 ratio by volume, while on the other hand, KB 1372 LP employs a 100:25 ratio by weight.
The manufacturer provides accurate mixing instructions and ratio specifications. Ensure that you’re rigidly complying with these mixing guidelines.
In addition to using the right mixing ratio for resin: hardener, it is paramount that the two components are thoroughly mixed. Insufficient or partial mixing can lead to patchy cure – leaving the cured epoxy to be sticky or soft in certain areas.
Refer to our advanced tips for using two-component epoxy adhesives for a more comprehensive overview of the topic.
2. Vacuum Degassing
It is essential to remove air bubbles during mixing. Bubbles cause surface flaws, reduce strength, and lead to material failure. Vacuum degassing uses a vacuum chamber to lower pressure, thus expanding bubbles and letting them exit the liquid epoxy resin.
Vacuum Degassing Benefits:
- Strength: Trapped air bubbles weaken the cured resin. Degassing removes these weak points.
- Void Reduction: Degassing limits air pockets. This makes the cured product solid and uniform.
- Appearance: Bubbles create cloudy or pitted surfaces. Degassing improves the product’s final appearance.
3. Application
After mixing is done, apply the adhesive within its designated pot life, which can range from 15 minutes to several hours, as it varies based on its formulation.
Operators must ensure that the work is carried out in appropriately ventilated areas as specified in the product’s safety data sheet (SDS). They must also make use of appropriate personal protective equipment, or PPR, like gloves and respirators, while applying the adhesive.
Two-part epoxies can be applied using spatulas for manual application, syringes and DB cartridges for semi-automatic application, and MMD (meter-mix-dispense) equipment for fully automated application.
4. Curing
Many of our two-component epoxy adhesives are designed to cure at room temperature, which provides additional process flexibility. But certain adhesive applications can benefit from accelerated thermal curing, which typically occurs in the range of 60°C to 150°C. This enhances its chemical and thermal resistance.
Conclusion
Our two-part epoxy adhesive solutions have been specifically designed to provide ultra-precision bonding, advanced electrical conductivity or insulation, thermal management, and chemical resilience.
Their optimum performance under mechanical stress, thermal cycling, and extreme exposure to harsh environments makes them ideally suited for mission-critical applications such as electronics, aerospace, medical, optics, and OEM sectors.
As one of the premier adhesive manufacturers in India, we strive to support industries with performance-oriented solutions, whether you’re working with a two-part epoxy or require support for specialist applications in the epoxy adhesive India markets.
FAQs
Two-component epoxies are composed of two separate components, one resin and one hardener, which are mixed in a specific ratio to trigger polymerisation and provide structural bonding.
Pot life simply refers to the usable application time of the adhesive post mixing. This can range from 15 minutes to several hours based on environmental conditions and product formulation.
Always adhere to the prescribed mixing ratio. For example, 100:10 for KB 1040 CTE LO or 1:3 for KB 1031 AT‑2LO. Utilise clean mixing tools and maintain uniform blending by scraping off the sides as well as the bottom of the container.
It is important to avoid air entrapment by carrying out the mixing process slowly. Vacuum degassing is the preferred option to use in high-precision applications.
Two-component adhesives bond well to metals, ceramics, glass, plastics, and composite materials. For optimal performance, surface preparation practices such as degreasing and light abrasion are advisable.
Cure time varies from minutes to over 24 hours, depending on the product and conditions. Heat curing significantly accelerates the process.
A comparison between one-component and two-component epoxies reveals distinct benefits that cater to different needs in various applications. Two-component systems stand out for their ability to fine-tune performance parameters such as cure rate, mechanical strength, and resistance to chemicals, offering a high degree of flexibility. Conversely, one-component systems are favoured for their simplicity in usage, but they may not offer the same level of customisation as their two-component counterparts.
Yes, dual-cartridge or pre-mixed options are available for selection. Users can opt for formulations that come in syringes or dual-cartridge systems, providing a simple and efficient solution for mixing and dispensing.
Kohesi Bond offers products certified under NASA ASTM E‑595 (low outgassing), UL 94 V-0 (flame retardancy), and USP Class VI (biocompatibility for medical use). Kindly visit our Industrial Certifications section to learn more.
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Utsav Shah is a 34-year-old entrepreneur with a passion for scientific discovery. Utsav’s journey began with a deep dive into materials science, earning degrees from USC and the Institute of Chemical Technology. He’s the visionary founder of Kohesi Bond, a top-rated adhesive manufacturer, and Cenerge Engineering Solutions, a leader in heat exchangers and cryogenic pumps. With over a decade of experience, Utsav consults across various industries, ensuring they have the perfect adhesive solution for their needs. Connect with him on LinkedIn!
