Kohesi Bond’s UHV-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595) and can successfully operate at pressures up to 1 x 10-12 torr. One of the key concerns while selecting an adhesive for vacuum applications is its serviceability in an extremely high vacuum environment (> 10-8 torr). Any outgassing from the adhesive could lead to failure of crucial components of the system. To avoid such contamination, degradation weight loss and failure during operation, even at elevated temperatures, NASA developed the ASTM E-595 low outgassing test standard. This test involves collecting volatiles from the test specimen and weighing the condensate to determine the following:
- CVCM: The amount of collected volatile condensable materials (CVCM) on the collector plate.
- TML: The amount of total mass loss (TML) by the sample
- WVR: The amount of water vapor regained (WVR) by the sample
- The material is said to pass or fail the test based on the following conditions:
- CVCM < 0.1% and TML < 1% – Pass
- CVCM < 0.1% and TML > 1% – Pass if TML – WVR <1%
- CVCM > 0.1% or TML – WVR > 1% – Fail
In addition to low outgassing, epoxies need to also withstand cryogenic conditions for a large number of ultra high vacuum applications. Kohesi Bond has specially formulated adhesives, sealants, coatings, potting and encapsulation compounds that are capable of passing all stringent perquisites, including operation over wide temperatures (4K to over 815°C), resistance to acids, bases and solvent, ability to withstand mechanical shocks and CTE mismatches. Manufacturers of various space components, satellites, airplanes, unmanned air vehicles (UAV’s), valves, tubings, flanges and sensors have successfully employed Kohesi Bond products to meet their challenging ultra high vacuum requirements.
KB 1039 CRLP
Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
KB 1040 CTE-LO
Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.
KB 10473 FLAO
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.