Electronics-Grade Epoxy Adhesives for PCB & Semiconductor Manufacturing
We formulate electronic epoxy systems with controlled ionic purity and matched thermal expansion, built for PCB assembly and semiconductor packaging where one defect trace can end a production run. As trusted industrial electronic adhesives suppliers, our formulations are engineered to hold up under the exact thermal, electrical, and reliability demands your assembly line requires.
- Low Ionic Purity
- CTE Stabilisation
- Flame Retardancy
Featured Electronics-Grade Bonding Products
Discover our comprehensive range of custom-formulated adhesives for electronic applications, designed for superior thermal, electrical, and dielectric performance in demanding PCB and semiconductor manufacturing environments. For advanced semiconductor adhesive solutions, explore our product line below.
TUF 1613 HT DA
Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems,
TUF 1613 HT GT
Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures.
KB 1613 RLV
Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a
Key Technical Highlights
A CTE mismatch of even a few ppm/°C between a die and its substrate builds stress with every thermal cycle. Left unmanaged, that stress cracks solder joints and delaminates bond lines well before the rated service life ends. Generic epoxies are not formulated to track substrate expansion this tightly, and that gap is where field failures start.
We engineer adhesive for electronic components to close the thermal expansion gap, matched to the CTE, dielectric, and ionic purity requirements of PCB assembly and semiconductor packaging.
- Ultra-low ionic chloride and sodium content for long-term reliability
- CTE matched to silicon, FR4, and ceramic substrates
- High dielectric strength and controlled volume resistivity
- UL 94 V-0 flame-retardant formulations available
Consumer electronics, telecom, industrial control, and automotive manufacturers use our extensive electronics adhesive range to protect ICs, PCBs, connectors, sensors, and power modules. Specialty grades meet RoHS, REACH, and UL flame-retardancy standards, and our specialists customise viscosity, cure speed, and electrical performance to your process – supporting everything from precision consumer electronics bonding to heavy-duty automotive assembly lines.
Your Technical Partner in Assembly Solutions
We supply specialised electronics assembly adhesives at production scale to consumer electronics, telecom, industrial control, and automotive manufacturers. Our specialised formulations comply with RoHS, REACH, and UL flame-retardancy requirements, with customisable viscosity, cure profiles, and electrical properties tailored to your assembly line.
When a standard grade cannot meet your ionic purity or CTE target, our formulation team builds one that does. You get a system tested against your exact thermal, electrical, and reliability requirements, not a generic datasheet.
Our catalogue spans multiple SKUs under Electronics & Electrical, including conductive die-attach pastes, conformal coatings, glob tops, and underfills. Each is validated against the thermal and electrical demands of modern assembly lines.
When you source from industrial electronic component adhesive manufacturers, you need engineering support behind the datasheet, not just numbers on a page. We provide that directly.
- Need Proven Performance?
Need a custom electronics-grade epoxy or specific technical datasheet for your production line?
Electronics Adhesive Applications Across PCB and Semiconductor Manufacturing
Every stage of your line, from bare die to final board assembly, carries a different failure mode and needs a different chemistry from our adhesives for electronics range.
- Conformal Coating
- Die Attach
- Glob Top
- Surface Mounting
- Underfilling
- EMI / RFI Shielding
- PCB and Semiconductor Manufacturing and Packaging
Your Partner in Technical Success.
Access comprehensive technical documentation and expert support to ensure optimal performance in your PCB and semiconductor bonding applications.
Advanced Semiconductor Packaging and PCB Application Areas
We engineer distinct semiconductor adhesive systems for every stage from die attach through encapsulation, built for precision dispensing and screen printing.
Weak thermal contact at die attach traps heat under the active device, accelerating junction failure. We bond dies to lead frames and heat sinks at a conductivity above 3 W/(m·K). Silver-filled grades deliver a conductive electric epoxy bond at ≤10⁻⁴ ohm-cm.
Uncontrolled resin flow during encapsulation sweeps fine wire bonds out of position, opening the circuit before shipment. Our thixotropic glob top resin dispenses cleanly around delicate wire bonds without sagging or causing wire sweep, curing into a rigid protective dome that isolates the die as an electronics sealant.
Thermal cycling flexes BGA solder joints until they crack, often within a few hundred cycles. Our capillary underfill fills the gap beneath BGAs and flip chips, with Tg above 140°C and low CTE, helping improve solder-joint reliability under thermal cycling as an adhesive for electronic components.
Components that shift during board flipping before wave soldering create open joints and hours of rework. Our high-dot, non-slumping electronics assembly adhesives hold components in place through automated dispensing and the full pre-solder handling process.
A single void in a potted power module becomes a path for moisture ingress and internal arcing. Our solvent-free potting compound fully encapsulates transformers and sensors without trapping air, sealing electronic components at dielectric strength above 18 kV/mm.
Unshielded high-frequency assemblies leak electromagnetic noise, triggering EMC compliance failures. Our conductive epoxies, loaded with silver or nickel-graphite fillers, form continuous shielding pathways for electronics bonding in housings and enclosures, holding low resistivity through thermal cycling.
Switching materials between process stages introduces cure incompatibilities and inconsistent adhesion. Our full pcb adhesive portfolio covers every stage from die attach through encapsulation with consistent cure profiles, making us a single-source partner across your line.
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Frequently Asked Questions
Ionic contamination below 10 ppm, CTE matched to the substrate, and proven dielectric strength separate an electronics-grade resin from a general-purpose epoxy. Without these controls, corrosion and thermal fatigue show up well before the end of life.
Yes, every grade in our range meets RoHS and REACH requirements. Many also carry UL 94 V-0 flame retardancy certification, which matters when you source from electronics adhesive manufacturers for regulated markets.
Conformal coating protects the full board surface; glob top shields an individual wire-bonded die; and underfill fills the gap beneath a BGA or flip chip. Each targets a different failure mode, so using the wrong one leaves part of the assembly unprotected.
Yes, our formulations hold up through the higher thermal profiles lead-free reflow requires, including repeated reflow cycles. We validate this against your specific process before you commit to a production run.
Yes, we supply silver-filled and nickel-graphite conductive systems for EMI shielding alongside epoxy glue for electronics used in die-attach. Both hold volume resistivity at or below 10⁻⁴ ohm-cm.
Yes, qualified manufacturers can request samples to evaluate fit before committing to a production line by getting in touch with our team. We turn requests around within a few business days, standard practice among industrial electronic component adhesive manufacturers serving production timelines.