We manufacture both structural epoxy systems as one-component, heat-activated formulations and two-component, room-temperature-curing systems, so the choice fits your process instead of forcing your process to fit the adhesive.
Discover our comprehensive range of custom-formulated epoxy sealants and epoxy resin glue designed for superior process compatibility and performance across demanding industrial assembly applications. For advanced bonding solutions, explore our product line below.
Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature.
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature.
This product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C.
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
TUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
KB 1427 HT is a path-breaking one part epoxy used for bonding, sealing, coating and casting applications. It offers a roaring glass transition temperature Tg of 220°C – 230°C and stellar chemical resistance to a wide variety of fuels, oil and water.
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
Kohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
Kohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns.
Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.
Kohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C.
Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE).
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass.
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure.
Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability.
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability.
Kohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.
Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test.
Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life.
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
KB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
Every epoxy resin glue starts from the same resin and hardener chemistry, but the wrong packaging choice creates problems the chemistry itself never would. A 2K system left unmixed past its pot life gels in the cartridge, and a 1K system pulled off the shelf without proper cold storage can partially cure before it ever reaches your dispenser. How each epoxy system is packaged and activated determines how it performs on your line.
Whether your line runs automated 1K dispensing or room-temperature 2K curing, our R&D team tailors viscosity, Tg, colour, and thixotropy to your process. We also formulate low temperature epoxy adhesive systems for lines that can’t support a high-temperature cure oven.
From low-viscosity potting compounds to high-thixotropy non-sag pastes, we tune cure kinetics, glass transition temperature (Tg), and rheology across our entire industrial epoxy adhesive range.
When a standard 1K or 2K grade can’t meet your process window, our formulation team builds a structural epoxy system that does. You get a system tested against your exact process and performance requirements, not a generic datasheet.
As established epoxy adhesive manufacturers, our catalogue spans multiple SKUs across 1K and 2K systems, each validated against your line’s mix ratio, pot life, and cure profile – from industrial strength epoxy adhesive for high-load bonding to fast-cure grades for high-throughput production.
We back every product with direct technical support, which helps you select the right format before you commit to a production run, whether you’re sourcing directly or through epoxy adhesive suppliers.
Not sure your current adhesive was ever tested against the specific chemical it’s exposed to?
Access comprehensive technical documentation and expert support to ensure optimal performance in your one-component and two-component epoxy system applications.
A mixing error on the line scraps a batch before it ever cures, and a missed ratio can go undetected until the part fails downstream. As leading epoxy adhesive manufacturers, our pre-mixed, heat-activated one-component epoxy formulations remove that risk entirely, delivering consistent cure with no mix step and long shelf-life stability.
Oven cure isn’t available on every line, and forcing a heat-activated system onto room-temperature equipment stalls production. Our two-component systems cure at room temperature with mix ratios from 1:1 to 4:1, giving you the versatility to adjust pot life and cure speed to your exact process.
Filling out the form below will send your inquiry directly to Kohesi Bond’s technical support department.
A one-component system is pre-mixed and activated by heat, removing the mixing step entirely. A two-component system ships as separate Part A and Part B, mixed at point of use and cured at room temperature.
Unopened two-component systems generally offer a longer shelf life at ambient temperatures (12+ months) because Part A and Part B are stored separately. One-component systems require refrigerated storage from -40°C to 4°C to maintain stability and typically have a 3 to 6-month shelf life.
Yes, many of our 2K formulations accept an accelerated heat cure to cut cycle time on the line. Ask our technical team for the specific temperature and time profile for your chosen grade.
Yes, we formulate versatile mix ratios from 1:1 up to 10:1 (or custom volumetric/gravimetric ratios) to match automated meter-mix-dispense (MMD) equipment. Custom ratios outside that range are available through our formulation team on request.
The decision comes down to your cure equipment and shelf-life needs. If your line has an oven and needs long, worry-free storage, choose 1K; if you need room-temperature cure without heat equipment, choose 2K.
Yes, as one of the leading industrial epoxy adhesive suppliers offering in-house formulation, we build custom systems tested to your exact requirements. Share your process parameters with our technical team to start the evaluation.