Epoxy Adhesive Systems: One-Component & Two-Component
We manufacture both structural epoxy systems as one-component, heat-activated formulations and two-component, room-temperature-curing systems, so the choice fits your process instead of forcing your process to fit the adhesive.
- 300+ Formulations
- 1K/2K Systems
- Custom Formulation
Featured One & Two-Component Epoxy Products
Discover our comprehensive range of custom-formulated epoxy sealants and epoxy resin glue designed for superior process compatibility and performance across demanding industrial assembly applications. For advanced bonding solutions, explore our product line below.
One Component Epoxy Products
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TUF 1828 TC – Toughened Thermally Conductive One-Component Epoxy Adhesive
Read moreKohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature.
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TUF 1820 ANHT – Toughened Anaerobic High-Temperature One-Component Epoxy
Read moreKohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
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TUF 1613 HT SM – Toughened Surface-Mount High-Temperature One-Component Epoxy
Read moreKohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
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TUF 1613 HT GT – Toughened Glob-Top High-Temperature One-Component Epoxy
Read moreKohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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TUF 1613 HT CM – Toughened High-Temperature Epoxy for Ceramic & Metal Bonding
Read moreKohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
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KB 1613 RLV – Low Viscosity One-Component Epoxy for Underfill & Potting
Read moreKohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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KB 1613 R80 – One-Component Rigid Epoxy Adhesive with High Hardness
Read moreKohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature.
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KB 1427 HT-3 – High-Temperature Grade 3 One-Component Epoxy for Harsh Environments
Read moreThis product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C.
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TUF 1820 HTS – Toughened High-Temperature Structural One-Component Epoxy
Read moreTUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
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TUF 1613 HT DA – Toughened Die Attach High-Temperature One-Component Epoxy
Read moreTUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
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KB 1427 HT – High-Temperature One-Component Epoxy Adhesive & Sealant
Read moreKB 1427 HT is a path-breaking one part epoxy used for bonding, sealing, coating and casting applications. It offers a roaring glass transition temperature Tg of 220°C – 230°C and stellar chemical resistance to a wide variety of fuels, oil and water.
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TUF 1820 AOHT – Toughened Aerospace Epoxy with High-Temp & Low Outgassing
Read moreTUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
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KB 1613 HT – High-Temperature One-Component Epoxy Adhesive & Encapsulant
Read moreKB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
Two Component Epoxy Products
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KB 1600 FR-V – Flame Retardant Low-Viscosity Two-Component Epoxy Adhesive
Read moreKohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
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KB 1458 TC – Thermally Conductive Two-Component Epoxy for Heat Management
Read moreKohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns.
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KB 1452 HT-2 AO – Aerospace Low Outgassing High-Temperature Two-Component Epoxy
Read moreKohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.
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KB 1372 AO – Aerospace Two-Component Low Outgassing Epoxy Adhesive
Read moreKohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C.
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KB 1372 LP – Low-Viscosity Pourable Two-Component Epoxy for Potting
Read moreKohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040 AOHT – Aerospace-Grade High-Temperature Two-Component Epoxy Adhesive
Read moreKohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE).
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TUF 1621 AOHT – Aerospace-Grade Toughened High-Temperature Epoxy Adhesive
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
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TUF 1452 HT-2 – Toughened High-Temperature Two-Component Epoxy Adhesive
Read moreKohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass.
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KB 10473 FLAO – Flame Retardant Aerospace Low Outgassing Two-Component Epoxy
Read moreKohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
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KB 10473 FL – Flame Retardant Two-Component Epoxy Potting & Encapsulation Compound
Read moreKohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1689 – Two-Component Flexible Epoxy Adhesive for Industrial Bonding
Read moreKohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure.
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KB 1686 M – Two-Component Medical Grade Epoxy Adhesive – Biocompatible
Read moreKohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability.
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KB 1631 AOLV-1 – Low Viscosity Aerospace-Grade Low Outgassing Epoxy Adhesive
Read moreKohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1631 ANHT – Anaerobic High-Temperature Two-Component Epoxy Adhesive
Read moreKohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1372 LO – Low Outgassing Two-Component Epoxy for Space & Vacuum Applications
Read moreKohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
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KB 1085-1 – Two-Component Epoxy Adhesive with High Peel & Flexibility
Read moreKohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability.
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KB 1048 – Two-Component General Purpose Epoxy Adhesive for Multi-Substrate Bonding
Read moreKohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 1040 – Two-Component Room Temperature Cure Industrial Epoxy Adhesive
Read moreKohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 1040 QF – Quick-Fix Two-Component Fast-Cure Epoxy Adhesive
Read moreKohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040 P – Two-Component Paste Epoxy Adhesive for Vertical & Overhead Bonding
Read moreKohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
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KB 1040 CTE-LO – Low CTE Low Outgassing Two-Component Epoxy for Aerospace
Read moreKohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.
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KB 1040 AN-1 – Anaerobic Two-Component Epoxy Adhesive for Thread & Retaining
Read moreKohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test.
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KB 1039 CRLP AO – Chemical Resistant Aerospace Low Outgassing Two-Component Epoxy
Read moreKohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1039 CRLP – Chemical Resistant Low Viscosity Pourable Two-Component Epoxy
Read moreKohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1031 SPLV-6 – Super Low Viscosity Two-Component Epoxy for Capillary Bonding
Read moreKohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life.
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KB 1031 AT-S – Two-Component Structural Epoxy Adhesive for Precision Bonding
Read moreKohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
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KB 1031 ATHT LO – High-Temperature Low Outgassing Epoxy for Space Applications
Read moreKohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
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KB 1031 ATFL-N – Flame Retardant Non-Halogen Two-Component Epoxy Adhesive
Read moreKohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
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KB 1031 AT-2 LO – Low Outgassing Two-Component Epoxy for Aerospace & Space
Read moreKB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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KB 1631 HTC-1 – High-Temperature Conductive Two-Component Epoxy Adhesive
Read moreKB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
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KB 1631 FR-2 – Flame Retardant Two-Component Epoxy Adhesive & Encapsulant
Read moreKB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
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KB 1452 HT-2 – High-Temperature Two-Component Epoxy Adhesive & Encapsulant
Read moreKB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
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KB 1151 S-1 – Two-Component Structural Epoxy Adhesive for High Load Bonding
Read moreKB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
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KB 1040-2 – Two-Component Epoxy Adhesive with Extended Pot Life
Read moreKB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
One-Component vs Two-Component Epoxy System Chemistry Explained
Every epoxy resin glue starts from the same resin and hardener chemistry, but the wrong packaging choice creates problems the chemistry itself never would. A 2K system left unmixed past its pot life gels in the cartridge, and a 1K system pulled off the shelf without proper cold storage can partially cure before it ever reaches your dispenser. How each epoxy system is packaged and activated determines how it performs on your line.
- One-component systems: pre-mixed, heat-activated, no mixing errors
- Two-component systems: separate Part A/B, mixed at point of use
- Flexible Mix Ratios: 1:1 to 10:1 (or custom volumetric/gravimetric ratios) for seamless meter-mix-dispense (MMD) integration.
- Pot life from 5 minutes to 4+ hours depending on formulation
Whether your line runs automated 1K dispensing or room-temperature 2K curing, our R&D team tailors viscosity, Tg, colour, and thixotropy to your process. We also formulate low temperature epoxy adhesive systems for lines that can’t support a high-temperature cure oven.
High-Performance Epoxy Systems for Industrial Assembly
From low-viscosity potting compounds to high-thixotropy non-sag pastes, we tune cure kinetics, glass transition temperature (Tg), and rheology across our entire industrial epoxy adhesive range.
When a standard 1K or 2K grade can’t meet your process window, our formulation team builds a structural epoxy system that does. You get a system tested against your exact process and performance requirements, not a generic datasheet.
As established epoxy adhesive manufacturers, our catalogue spans multiple SKUs across 1K and 2K systems, each validated against your line’s mix ratio, pot life, and cure profile – from industrial strength epoxy adhesive for high-load bonding to fast-cure grades for high-throughput production.
We back every product with direct technical support, which helps you select the right format before you commit to a production run, whether you’re sourcing directly or through epoxy adhesive suppliers.
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Epoxy Sealants and Adhesive System Applications by Process
A mixing error on the line scraps a batch before it ever cures, and a missed ratio can go undetected until the part fails downstream. As leading epoxy adhesive manufacturers, our pre-mixed, heat-activated one-component epoxy formulations remove that risk entirely, delivering consistent cure with no mix step and long shelf-life stability.
Oven cure isn’t available on every line, and forcing a heat-activated system onto room-temperature equipment stalls production. Our two-component systems cure at room temperature with mix ratios from 1:1 to 4:1, giving you the versatility to adjust pot life and cure speed to your exact process.
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Frequently Asked Questions
A one-component system is pre-mixed and activated by heat, removing the mixing step entirely. A two-component system ships as separate Part A and Part B, mixed at point of use and cured at room temperature.
Unopened two-component systems generally offer a longer shelf life at ambient temperatures (12+ months) because Part A and Part B are stored separately. One-component systems require refrigerated storage from -40°C to 4°C to maintain stability and typically have a 3 to 6-month shelf life.
Yes, many of our 2K formulations accept an accelerated heat cure to cut cycle time on the line. Ask our technical team for the specific temperature and time profile for your chosen grade.
Yes, we formulate versatile mix ratios from 1:1 up to 10:1 (or custom volumetric/gravimetric ratios) to match automated meter-mix-dispense (MMD) equipment. Custom ratios outside that range are available through our formulation team on request.
The decision comes down to your cure equipment and shelf-life needs. If your line has an oven and needs long, worry-free storage, choose 1K; if you need room-temperature cure without heat equipment, choose 2K.
Yes, as one of the leading industrial epoxy adhesive suppliers offering in-house formulation, we build custom systems tested to your exact requirements. Share your process parameters with our technical team to start the evaluation.